TT Electronics/IRC

GS8B034991GCT

GS8B034991GCT Description

The GS8B034991GCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin Narrow SOIC (SOIC-C Series) device integrates 15 bussed resistors with a 4.99KΩ resistance value and a tight ±2% absolute tolerance. Built using thin-film technology, it offers excellent stability with a low ±25ppm/°C temperature coefficient, ensuring reliable performance across a wide temperature range (70°C to 125°C). The 0.05W (1/20) power rating per resistor and 0.8W total power rating make it suitable for low-power circuits, while its 100V maximum voltage rating enhances versatility. The gull-wing termination and surface-mount design facilitate easy PCB integration.

GS8B034991GCT Features

• Ceramic substrate for superior thermal and mechanical stability.
• Bussed network topology simplifies circuit design by connecting multiple resistors to a common node.
• Precision thin-film technology ensures low noise and high accuracy (±2% tolerance, ±0.25% ratio tolerance).
• Compact SOIC package (9.91mm x 5.99mm x 1.45mm) with tight dimensional tolerances (±0.1mm length/height, ±0.2mm depth).
• Wide operating temperature range (-55°C to +125°C) with derated power up to 125°C.
• RoHS non-compliant (note for restricted applications).

GS8B034991GCT Applications

Ideal for precision analog circuits, voltage dividers, and signal conditioning in industrial, medical, and test/measurement equipment. Its low TCR and high stability make it suitable for ADC/DAC reference networks, sensor interfaces, and feedback loops in control systems. The bussed configuration is particularly useful in bus termination, pull-up/pull-down networks, and digital logic circuits requiring matched resistances.

Conclusion of GS8B034991GCT

The GS8B034991GCT stands out for its ceramic construction, precision thin-film resistors, and robust SOIC packaging, offering a reliable solution for demanding electronic designs. While not automotive-grade or PPAP-capable, its thermal performance, tight tolerances, and bussed architecture make it a top choice for high-reliability applications where consistency and durability are critical. Engineers will appreciate its balance of size, performance, and ease of integration in space-constrained designs.