TT Electronics/IRC

GS8B035490CCT

GS8B035490CCT Description

The GS8B035490CCT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 16-pin Narrow SOIC device features 15 bussed resistors with a 549Ω resistance value, offering an absolute tolerance of ±0.25% and a ratio tolerance of ±0.25%. Built with thin-film technology, it delivers exceptional stability with a low temperature coefficient of ±25ppm/°C, ensuring reliable performance across a wide temperature range of -70°C to +125°C. The SOIC package (9.91mm x 5.99mm x 1.45mm) with gull-wing terminations enables easy surface-mount assembly, while its 0.05W (1/20) power rating per resistor and 0.8W total power rating make it suitable for compact, high-density designs.

GS8B035490CCT Features

• Precision Resistance: 549Ω ±0.25% tolerance with ±25ppm/°C thermal stability.
• Robust Construction: Ceramic case ensures durability and thermal performance.
• High-Density Integration: 15 bussed resistors in a 16-pin SOIC package (9.91mm x 5.99mm).
• Wide Operating Range: -70°C to +125°C with derated power up to 125°C.
• Surface-Mount Ready: Gull-wing terminations (1.27mm pitch) for automated PCB assembly.
• Low Power Dissipation: 0.05W per resistor, ideal for energy-sensitive applications.
• Non-Automotive: Compliant with EAR99 (ECCN) but not PPAP or RoHS certified.

GS8B035490CCT Applications

This resistor network excels in precision analog and digital circuits, including:

• Voltage Divider Networks: Stable ratio tolerance (±0.25%) ensures accurate signal conditioning.
• Sensor Interface Circuits: Low TCR (±25ppm/°C) minimizes drift in temperature-sensitive systems.
• Medical & Test Equipment: High reliability and tight tolerances meet stringent performance requirements.
• Industrial Control Systems: Ceramic construction withstands harsh environments.
• Communication Hardware: Compact SOIC footprint saves space in RF and signal-processing modules.

Conclusion of GS8B035490CCT

The GS8B035490CCT combines precision, durability, and integration in a single package, making it a standout choice for engineers designing high-accuracy circuits. Its thin-film technology, ceramic case, and bussed architecture provide superior performance over standard thick-film networks, particularly in applications requiring thermal stability and tight tolerances. While not suited for automotive use, it is ideal for industrial, medical, and communication systems where reliability and space efficiency are critical.