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GS8B035491DT
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GS8B035491DT Description
GS8B035491DT Description
The GS8B035491DT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 5.49KΩ resistance value and an ultra-tight ±0.5% tolerance, ensuring exceptional accuracy. Built with thin-film technology, it offers a low ±25ppm/°C temperature coefficient, making it ideal for stable performance across a -70°C to +125°C operating range. The SOIC package (9.91mm × 5.99mm × 1.45mm) with gull-wing terminations ensures reliable surface-mount assembly, while its ceramic case provides superior thermal and mechanical durability. Rated for 100V maximum voltage and 0.8W total power dissipation, it meets rigorous industrial standards.
GS8B035491DT Features
- Precision Network: 15 bussed resistors with 0.5% absolute tolerance for high-accuracy circuits.
- Stable Performance: ±25ppm/°C TCR and 125°C max operating temperature ensure reliability in thermal extremes.
- Robust Construction: Ceramic SOIC package resists mechanical stress and heat, outperforming plastic alternatives.
- Space-Efficient: Compact 16-pin narrow SOIC (1.27mm pitch) optimizes PCB real estate.
- High Power Handling: 0.05W per resistor (0.8W total) with derating up to 125°C.
- Non-Automotive: Suitable for industrial, telecom, and instrumentation applications requiring precision.
GS8B035491DT Applications
- Voltage Division & Pull-Up Networks: Ideal for ADC/DAC reference circuits and sensor interfaces.
- Signal Conditioning: Precision attenuation in test/measurement equipment.
- Industrial Controls: Stable performance in PLCs, motor drives, and power supplies.
- Telecom Infrastructure: Reliable termination for high-speed data lines.
- Aerospace & Defense: Ceramic construction suits harsh environments with thermal cycling.
Conclusion of GS8B035491DT
The GS8B035491DT stands out for its precision, thermal stability, and rugged ceramic packaging, making it a superior choice for applications demanding tight tolerances and long-term reliability. While not PPAP or automotive-qualified, its thin-film technology and bussed design excel in industrial and high-reliability systems. Engineers will value its space-saving SOIC footprint and consistent performance under extreme conditions.



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