TT Electronics/IRC

GS8B035491FFT

GS8B035491FFT Description

The GS8B035491FFT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 16-pin Narrow SOIC device features 15 bussed resistors with a 5.49KΩ resistance value, offering an absolute tolerance of ±1% and a ratio tolerance of ±1%. Built with thin-film technology, it ensures excellent stability and low noise, making it ideal for precision circuits. The SOIC package (9.91mm × 5.99mm × 1.45mm) is optimized for surface-mount assembly, with a gull-wing termination for reliable solder joints. Rated for 100V maximum voltage and 0.8W total power dissipation, it operates across a wide temperature range of -70°C to +125°C, with a low TCR of ±25ppm/°C for minimal resistance drift.

GS8B035491FFT Features

• Bussed Network Design: 15 resistors sharing a common node, simplifying bus line designs.
• High Precision: ±1% absolute tolerance and ±1% ratio tolerance for matched performance.
• Robust Construction: Ceramic substrate with thin-film technology for durability and thermal stability.
• Wide Operating Range: -70°C to +125°C with derated power up to 125°C.
• Low TCR: ±25ppm/°C ensures minimal resistance variation under temperature fluctuations.
• Compact SOIC Package: 16-pin narrow profile (9.91mm × 5.99mm × 1.45mm) saves PCB space.
• Surface-Mount Ready: Gull-wing terminals for automated assembly compatibility.

GS8B035491FFT Applications

This resistor network excels in:

• Voltage Divider Circuits: Precision ratio tolerance ensures accurate signal conditioning.
• Bus Line Termination: Bussed design reduces component count in data/address lines.
• Industrial Controls: Stable performance in harsh environments (-70°C to +125°C).
• Test & Measurement Equipment: Low TCR and tight tolerances enhance calibration accuracy.
• Automotive & Aerospace (non-PPAP): Reliable operation in non-safety-critical subsystems.

Conclusion of GS8B035491FFT

The GS8B035491FFT combines precision, compactness, and thermal resilience, making it a superior choice for high-reliability analog and digital systems. Its ceramic thin-film construction and bussed topology streamline designs while meeting stringent tolerance requirements. While not PPAP-capable or automotive-grade, it is well-suited for industrial, instrumentation, and communication hardware where stability and space efficiency are critical. Engineers will appreciate its balance of performance and practicality in dense PCB layouts.