TT Electronics/IRC

GS8B035600CT

GS8B035600CT Description

The GS8B035600CT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, this bussed configuration integrates 15 resistors with a 560Ω resistance value and an exceptional ±0.25% tolerance. Built using thin-film technology, it delivers superior stability with a low ±25ppm/°C temperature coefficient, ensuring reliable performance across a -70°C to +125°C operating range. With a 100V maximum voltage rating and 0.05W (1/20) power rating per resistor, it is engineered for precision signal conditioning and voltage division in compact PCB layouts.

GS8B035600CT Features

• High Precision: ±0.25% absolute tolerance for critical analog circuits.
• Stable Performance: ±25ppm/°C TCR minimizes drift under thermal stress.
• Robust Construction: Ceramic substrate enhances durability and heat dissipation.
• Space-Efficient: SOIC-C series package (9.91mm × 5.99mm × 1.45mm) optimizes board space.
• Bussed Design: Simplifies circuit routing with shared connections (BUS configuration).
• Wide Temperature Range: Operates reliably from -70°C to +125°C (derated power).
• Surface-Mount Gull Wing Terminals: Ensures secure PCB attachment with 1.27mm pitch.

GS8B035600CT Applications

Ideal for precision electronics requiring tight resistance matching and thermal stability:

• Industrial Control Systems: Signal conditioning in PLCs and sensors.
• Medical Devices: High-accuracy analog front-end circuits.
• Test & Measurement Equipment: Voltage dividers and calibration networks.
• Automotive Electronics (non-Automotive PPAP): Engine control units (ECUs) in non-safety-critical roles.
• Communications Infrastructure: RF and baseband signal processing.

Conclusion of GS8B035600CT

The GS8B035600CT stands out for its ceramic thin-film construction, ultra-low tolerance, and bussed network topology, making it a superior choice for precision applications. While not PPAP-compliant, its wide temperature range and compact SOIC footprint cater to industrial, medical, and communication systems where reliability and space constraints are paramount. Engineers benefit from its repeatable performance and simplified design integration, reducing BOM complexity in high-density layouts.