TT Electronics/IRC

GS8B035620FFT

GS8B035620FFT Description

The GS8B035620FFT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 16-pin narrow SOIC device features 15 bussed resistors, each with a 562Ω resistance and a tight ±1% absolute tolerance. Built using thin-film technology, it delivers excellent stability with a low ±25ppm/°C temperature coefficient, ensuring reliable performance across a 70°C to 125°C operating range. The SOIC-C series package offers a compact footprint (9.91mm × 5.99mm × 1.45mm) with gull-wing terminations for easy surface mounting. Rated for 100V maximum voltage and 0.8W total power dissipation, it is ideal for precision analog and digital circuits.

GS8B035620FFT Features

• Ceramic substrate for superior thermal and mechanical stability.
• 15 bussed resistors in a 16-pin SOIC package, optimized for space-constrained designs.
• Thin-film technology ensures low noise and high accuracy (±1% tolerance).
• ±25ppm/°C TCR for minimal resistance drift over temperature.
• 0.05W (1/20W) power rating per resistor, with a 0.8W total package rating.
• Wide operating temperature range (-70°C to +125°C derated).
• Gull-wing termination for reliable surface-mount (SMD) assembly.
• Non-automotive grade (PPAP: No), suitable for industrial and telecom applications.

GS8B035620FFT Applications

This resistor network excels in:

• Voltage divider networks and pull-up/pull-down circuits in precision analog systems.
• Signal conditioning for sensors, ADCs, and DACs.
• Bus termination in high-speed digital interfaces (e.g., SPI, I²C).
• Industrial control systems requiring stable, low-drift resistance.
• Telecommunications equipment where compact, high-density PCBs are critical.

Conclusion of GS8B035620FFT

The GS8B035620FFT combines high precision, thermal resilience, and compact packaging, making it a standout choice for engineers designing robust analog or mixed-signal circuits. Its ceramic construction and thin-film technology provide long-term reliability, while the bussed architecture simplifies layout in multi-channel designs. Though not RoHS-compliant, it remains a top-tier solution for industrial and telecom applications demanding tight tolerances and low TCR.