TT Electronics/IRC

GS8B035621GDT

GS8B035621GDT Description

The GS8B035621GDT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, this bussed (BUS) configuration device integrates 15 thin-film resistors, each with a 5.62KΩ resistance and a tight ±2% absolute tolerance. Its ±25ppm/°C temperature coefficient ensures stable performance across a wide operating range of -70°C to +125°C, making it suitable for environments with thermal fluctuations. The SOIC-C series construction features a rectangular ceramic case, gull-wing termination, and surface-mount compatibility, offering robust mechanical and electrical reliability. With a 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances power handling with compact dimensions (9.91mm × 5.99mm × 1.45mm).

GS8B035621GDT Features

• Precision Thin-Film Technology: Delivers ±0.5% ratio tolerance for matched resistance values, critical for differential signal processing.
• High-Temperature Stability: ±25ppm/°C TCR minimizes resistance drift in thermally dynamic applications.
• Robust Construction: Ceramic substrate enhances thermal dissipation and mechanical durability versus polymer-based networks.
• Space-Efficient Design: Narrow SOIC (SOIC-C) footprint optimizes PCB real estate without sacrificing performance.
• Automation-Friendly: Gull-wing leads and 1.27mm pitch simplify pick-and-place assembly.
• Non-Automotive Compliance: Ideal for industrial and commercial use where PPAP is not required.

GS8B035621GDT Applications

• Signal Conditioning: Precision voltage dividers in data acquisition systems and sensor interfaces.
• Medical Electronics: Stable resistance networks for patient monitoring equipment requiring low drift.
• Test & Measurement: Calibration circuits in multimeters and oscilloscope probes.
• Industrial Controls: PLC modules and process instrumentation benefiting from high-temperature resilience.
• Telecom Infrastructure: Line termination and impedance matching in high-frequency communication devices.

Conclusion of GS8B035621GDT

The GS8B035621GDT excels in applications demanding precision, thermal stability, and compactness. Its ceramic thin-film design outperforms standard thick-film networks in harsh environments, while the bussed architecture simplifies circuit design. Though not RoHS-compliant, it remains a top choice for industrial, medical, and telecom systems where reliability trumps regulatory constraints. Engineers will appreciate its balance of performance, size, and cost in space-constrained, high-accuracy designs.