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GS8B035621GGT
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GS8B035621GGT Description
GS8B035621GGT Description
The GS8B035621GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 16-pin Narrow SOIC (SOIC-C series) device integrates 15 bussed resistors with a 5.62KΩ resistance value, offering a ±2% absolute tolerance and ±2% ratio tolerance. Built with thin-film technology, it ensures low temperature coefficient (±25ppm/°C) and stable performance across a wide temperature range (70°C to 125°C). The SOIC package features gull-wing terminations for reliable surface-mount assembly, with a compact footprint (9.91mm × 5.99mm × 1.45mm) and tight dimensional tolerances (±0.1mm length/height, ±0.2mm depth). Rated for 100V maximum voltage and 0.8W total power dissipation, it is ideal for space-constrained designs requiring high accuracy and thermal stability.
GS8B035621GGT Features
- Precision Network: 15 bussed resistors with 5.62KΩ ±2% tolerance and ±25ppm/°C thermal stability.
- Robust Construction: Ceramic substrate and thin-film technology for low noise and long-term reliability.
- High Power Handling: 0.05W per resistor (0.8W total) at 125°C maximum operating temperature.
- Compact SOIC Package: 16-pin narrow profile (1.27mm pitch) with gull-wing leads for automated SMT processes.
- Wide Voltage Range: Supports up to 100V, suitable for analog/digital signal conditioning.
- Non-Automotive: PPAP non-compliant, optimized for industrial/consumer electronics.
GS8B035621GGT Applications
- Signal Conditioning: Precision voltage dividers in ADC/DAC circuits.
- Bus Termination: Impedance matching for high-speed data lines (e.g., SPI, I²C).
- Medical/Test Equipment: Stable reference networks in sensor interfaces.
- Power Management: Load balancing in low-power DC/DC converters.
- Industrial Controls: Feedback networks for op-amps or comparators.
Conclusion of GS8B035621GGT
The GS8B035621GGT excels in precision analog circuits where thermal stability, compact size, and high resistance accuracy are critical. Its ceramic thin-film design and SOIC packaging make it a superior choice over bulkier or less stable alternatives (e.g., thick-film networks). While not RoHS-compliant, it remains a cost-effective solution for non-automotive industrial applications. Engineers will value its repeatable performance in signal integrity-sensitive designs.



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