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GS8B035760GBT
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GS8B035760GBT Description
GS8B035760GBT Description
The GS8B035760GBT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 576Ω resistance value and a tight ±2% absolute tolerance, ensuring reliable performance in demanding circuits. Built with thin-film technology, it offers excellent stability with a low ±25ppm/°C temperature coefficient, making it ideal for environments with fluctuating temperatures. The SOIC-C series package provides robust mechanical protection, while the gull-wing termination ensures secure surface mounting. With a maximum operating temperature of 125°C and a derated power range of 70–125°C, this resistor network is engineered for durability in industrial and commercial applications.
GS8B035760GBT Features
- High Precision: ±2% absolute tolerance and ±0.1% ratio tolerance for consistent performance.
- Robust Construction: Ceramic case and thin-film technology enhance thermal and mechanical stability.
- Wide Temperature Range: Operates reliably from 70°C to 125°C with derated power handling.
- Compact Design: 9.91mm length, 5.99mm depth, and 1.45mm height in a space-saving SOIC package.
- Low TCR: ±25ppm/°C ensures minimal resistance drift under thermal stress.
- High Voltage Rating: Supports up to 100V, suitable for various circuit designs.
- Surface-Mount Ready: Gull-wing terminals with 1.27mm pitch for easy PCB integration.
GS8B035760GBT Applications
This resistor network excels in:
- Analog and digital signal conditioning where precision resistance matching is critical.
- Industrial control systems requiring stable performance under thermal stress.
- Medical electronics due to its low drift and high reliability.
- Automotive subsystems (non-automotive grade) for sensor interfaces and bus termination.
- Test and measurement equipment demanding tight tolerance and low TCR.
Conclusion of GS8B035760GBT
The GS8B035760GBT stands out for its precision, durability, and compact form factor, making it a superior choice for engineers designing high-reliability circuits. Its ceramic construction, thin-film technology, and low TCR provide unmatched stability, while the SOIC package ensures compatibility with modern PCB layouts. Though not PPAP or automotive-grade, it remains a versatile solution for industrial, medical, and instrumentation applications where accuracy and thermal performance are paramount.



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