TT Electronics/IRC

GS8B036042JDT

GS8B036042JDT Description

The GS8B036042JDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 16-pin narrow SOIC (SOIC-C) package, this bussed (BUS) network integrates 15 thin-film resistors, each with a 60.4 kΩ resistance and a ±5% absolute tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a derated power capability up to 125°C, ensuring reliability in harsh environments. Its ±25 ppm/°C temperature coefficient and ±0.5% ratio tolerance make it ideal for applications requiring stable, matched resistances. The 0.05W (1/20) power rating per resistor and 100V maximum voltage rating further enhance its versatility.

GS8B036042JDT Features

• Ceramic substrate for superior thermal stability and durability.
• Thin-film technology ensures low noise and high precision.
• Gull-wing termination for reliable surface-mount (SMD) assembly.
• Compact dimensions: 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• Bussed (BUS) configuration simplifies circuit design by interconnecting resistors.
• High power rating: 0.8W total dissipation (0.05W per resistor).
• Non-automotive grade (PPAP: No), suitable for industrial and commercial use.
• Non-RoHS compliant, offering flexibility for legacy designs.

GS8B036042JDT Applications

This resistor network excels in:

• Precision voltage dividers and signal conditioning circuits due to its tight ratio tolerance (±0.5%).
• Industrial control systems requiring stable performance across temperature fluctuations.
• Test and measurement equipment where low TCR (±25 ppm/°C) minimizes drift.
• Power management modules leveraging its 100V voltage rating and robust ceramic construction.
• Legacy electronics needing non-RoHS compliant components.

Conclusion of GS8B036042JDT

The GS8B036042JDT stands out for its precision, thermal resilience, and compact SOIC packaging, making it a top choice for engineers designing high-reliability circuits. Its bussed architecture, low TCR, and ceramic substrate offer distinct advantages over polymer-based networks, particularly in temperature-sensitive or high-voltage applications. While not suited for automotive use, it is a robust solution for industrial, medical, and instrumentation markets demanding long-term stability and accuracy.