TT Electronics/IRC

GS8B036192GDT

GS8B036192GDT Description

The GS8B036192GDT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors with a 61.9 kΩ resistance value and a tight ±2% absolute tolerance. Its ±25 ppm/°C temperature coefficient ensures stability across a wide operating temperature range of 70°C to 125°C, making it suitable for environments with thermal fluctuations. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for surface-mount (SMD) assembly. With a 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances performance and reliability in compact designs.

GS8B036192GDT Features

• Precision Thin-Film Technology: Delivers low noise and high stability (±25 ppm/°C).
• Robust Ceramic Package: Enhances thermal management and mechanical durability.
• Bussed Network Configuration: Simplifies circuit design with shared common terminals.
• Tight Tolerances: ±2% absolute and ±0.5% ratio tolerance for matched performance.
• Wide Temperature Range: Operates from 70°C to 125°C with derated power.
• Surface-Mount Ready: 1.27mm terminal pitch and gull-wing leads for automated PCB assembly.
• Compact Dimensions: 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm).

GS8B036192GDT Applications

Ideal for precision analog and digital circuits requiring stable resistance matching, such as:

• Voltage Dividers & Sensor Interfaces: Ensures accurate signal conditioning.
• Medical Electronics: Reliable performance in diagnostic equipment.
• Industrial Control Systems: Withstands harsh environments due to ceramic construction.
• Automotive Electronics (non-automotive grade): Auxiliary systems where high-temperature stability is critical.
• Test & Measurement Equipment: Low TCR minimizes drift in calibration circuits.

Conclusion of GS8B036192GDT

The GS8B036192GDT excels in applications demanding high precision, thermal resilience, and compact integration. Its ceramic thin-film design and bussed architecture offer superior performance over polymer-based networks, particularly in high-temperature or precision-critical systems. While not PPAP or automotive-qualified, it remains a cost-effective solution for industrial and medical electronics where reliability and tolerance matching are paramount. Engineers will appreciate its balance of size, power handling, and stability in space-constrained designs.