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GS8B036192GT
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GS8B036192GT Description
GS8B036192GT Description
The GS8B036192GT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 61.9KΩ resistance value and a tight ±2% absolute tolerance. Built using thin-film technology, it delivers excellent stability with a low temperature coefficient of ±25ppm/°C, ensuring reliable performance across a wide temperature range of -70°C to +125°C. The SOIC package (9.91mm x 5.99mm x 1.45mm) with gull-wing terminations facilitates easy surface-mount assembly, while its ceramic case enhances durability and thermal management.
GS8B036192GT Features
- High Precision: ±2% tolerance and ±25ppm/°C TCR for stable performance in varying conditions.
- Robust Construction: Ceramic substrate ensures superior thermal and mechanical resilience.
- Optimized Power Handling: 0.05W per resistor (0.8W total) with 100V max rating, suitable for moderate-power applications.
- Space-Efficient Design: Compact SOIC-C series footprint (1.27mm pitch) ideal for dense PCB layouts.
- Bussed Configuration: Simplifies circuit design by interconnecting multiple resistors.
- Wide Operating Range: Functions reliably from -70°C to +125°C, even at derated power.
GS8B036192GT Applications
This resistor network excels in precision analog and digital circuits, including:
- Voltage Dividers & Pull-Up/Down Networks: Ensures signal integrity in communication systems.
- Sensor Interface Circuits: Stable resistance critical for ADC/DAC reference networks.
- Industrial Control Systems: Withstands harsh environments due to ceramic construction.
- Medical Electronics: Low TCR minimizes drift in diagnostic equipment.
- Automotive (Non-Automotive Rated): Auxiliary systems benefiting from high-density resistor arrays.
Conclusion of GS8B036192GT
The GS8B036192GT combines precision, durability, and compactness, making it a standout choice for engineers needing reliable resistor networks in space-constrained or thermally challenging designs. Its thin-film technology, bussed architecture, and ceramic case offer distinct advantages over polymer-based or discrete alternatives. While not PPAP or automotive-rated, it remains ideal for industrial, medical, and instrumentation applications where consistent performance is paramount. For projects demanding tight tolerances and robust packaging, this model delivers exceptional value.



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