TT Electronics/IRC

GS8B036200CT

GS8B036200CT Description

The GS8B036200CT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 16-pin narrow SOIC package features 15 bussed resistors with a 620Ω resistance value and an exceptional ±0.25% absolute tolerance, ensuring reliable performance in precision circuits. Built with thin-film technology, it offers a low temperature coefficient of ±25ppm/°C, maintaining stability across a wide operating range of -70°C to +125°C. The SOIC-C series construction provides robust thermal and mechanical performance, with a 0.8W total power rating (0.05W per resistor) and a maximum voltage rating of 100V. Its gull-wing termination and surface-mount design facilitate easy PCB integration.

GS8B036200CT Features

• High Precision: ±0.25% tolerance and ±25ppm/°C TCR for stable performance.
• Robust Construction: Ceramic case with rectangular SOIC package (9.91mm x 5.99mm x 1.45mm).
• Bussed Network: 15 resistors connected in a single bus configuration, simplifying circuit design.
• Wide Temperature Range: Operates from -70°C to +125°C with derated power up to 125°C.
• Surface-Mount Ready: 1.27mm terminal pitch and gull-wing leads for automated assembly.
• Thin-Film Technology: Delivers low noise and high reliability for precision applications.

GS8B036200CT Applications

• Voltage Division & Pull-Up/Down Networks: Ideal for ADC/DAC interfaces and signal conditioning.
• Industrial Controls: Suitable for PLC systems, sensors, and instrumentation requiring tight tolerance.
• Automotive Electronics: Despite non-automotive PPAP status, it fits non-safety-critical modules like infotainment.
• Medical Devices: Precision networks for diagnostic equipment where stability is critical.
• Telecom & Networking: Used in line termination and impedance matching circuits.

Conclusion of GS8B036200CT

The GS8B036200CT stands out for its precision, thermal stability, and compact SOIC footprint, making it a superior choice for high-reliability applications. While not PPAP-certified, its ceramic thin-film design and bussed architecture offer advantages over standard arrays in space-constrained, precision-centric designs. Engineers will value its low TCR, tight tolerance, and robust packaging for critical circuits in industrial, medical, and telecom systems.