TT Electronics/IRC

GS8B036200FDT

GS8B036200FDT Description

The GS8B036200FDT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 620Ω resistance value, offering an absolute tolerance of ±1% and a ratio tolerance of ±0.5%. Built with thin-film technology, it ensures excellent stability with a low temperature coefficient of ±25ppm/°C. The network operates within a wide temperature range of -55°C to +125°C, with derated power handling up to 125°C. Its SOIC package (9.91mm x 5.99mm x 1.45mm) provides a compact footprint for space-constrained designs, while gull-wing terminations enable reliable surface-mount assembly.

GS8B036200FDT Features

• High Precision: ±1% absolute tolerance and ±0.5% ratio tolerance for accurate signal conditioning.
• Robust Construction: Ceramic substrate ensures thermal stability and durability.
• Low TCR: ±25ppm/°C minimizes resistance drift over temperature variations.
• Compact Design: 16-pin narrow SOIC package (9.91mm x 5.99mm) optimizes PCB space.
• High Voltage Rating: Supports up to 100V, suitable for industrial and automotive environments.
• Power Handling: 0.8W total power dissipation (0.05W per resistor) for balanced performance.
• Surface-Mount Ready: Gull-wing terminations simplify automated assembly processes.

GS8B036200FDT Applications

This resistor network is ideal for:

• Voltage Division Circuits: Precision dividers in measurement equipment.
• Signal Conditioning: Buffering and impedance matching in communication systems.
• Industrial Controls: Stable resistance networks for PLCs and sensor interfaces.
• Automotive Electronics: Despite not being PPAP-compliant, it suits non-safety-critical automotive subsystems.
• Test & Measurement: High-accuracy instrumentation requiring minimal drift.

Conclusion of GS8B036200FDT

The GS8B036200FDT excels in precision and reliability, making it a standout choice for applications demanding tight tolerance and thermal stability. Its ceramic construction, low TCR, and compact SOIC package offer superior performance over plastic-based networks. While not automotive-grade, it is well-suited for industrial, telecom, and test equipment where accuracy and durability are paramount. Engineers will appreciate its balance of high voltage capability, power handling, and space efficiency in advanced electronic designs.