TT Electronics/IRC

GS8B036342BT

GS8B036342BT Description

The GS8B036342BT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, this bussed (BUS) configuration integrates 15 thin-film resistors with a 63.4KΩ resistance value and an ultra-tight ±0.1% absolute tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a derated power capability up to 125°C, ensuring reliability in harsh environments. Its ±25ppm/°C temperature coefficient minimizes resistance drift, while the 100V maximum voltage rating and 0.8W total power rating (0.05W per resistor) support robust performance in precision circuits.

GS8B036342BT Features

• High Precision: ±0.1% tolerance and ±25ppm/°C TCR for stable performance.
• Robust Construction: Ceramic substrate and gull-wing termination for durability and solderability.
• Space-Efficient: Compact SOIC package (9.91mm × 5.99mm × 1.45mm) with 1.27mm terminal pitch, ideal for high-density PCB layouts.
• Wide Operating Range: Supports -70°C to +125°C, derated to 125°C, suitable for industrial and automotive-adjacent applications.
• Bussed Design: Simplifies circuit routing with shared connections, reducing component count.
• Non-Automotive (PPAP No): Optimized for industrial, medical, and instrumentation use.

GS8B036342BT Applications

• Precision Analog Circuits: Voltage dividers, feedback networks, and sensor calibration.
• Test & Measurement Equipment: High-accuracy signal conditioning and reference circuits.
• Medical Electronics: Patient monitoring systems where stability is critical.
• Industrial Controls: PLCs, motor drives, and power management systems requiring low drift.
• Communications Infrastructure: RF and baseband signal processing.

Conclusion of GS8B036342BT

The GS8B036342BT excels in applications demanding high precision, thermal stability, and compact form factors. Its ceramic thin-film technology and bussed architecture offer superior performance over standard thick-film networks, making it ideal for mission-critical systems. While not PPAP-qualified for automotive use, its industrial-grade reliability and tight tolerances position it as a top choice for professional electronics designers. The SOIC package ensures compatibility with automated assembly processes, further enhancing its appeal for high-volume production.