TT Electronics/IRC

GS8B036342JCT

GS8B036342JCT Description

The GS8B036342JCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), it features 15 bussed resistors with a 63.4KΩ resistance value and a ±5% absolute tolerance. Built using thin-film technology, it offers excellent stability with a low temperature coefficient of ±25ppm/°C, ensuring reliable performance across a wide temperature range of 70°C to 125°C. The device is rated for 0.05W (1/20W) power dissipation per resistor and a total power rating of 0.8W, with a maximum operating voltage of 100V. Its surface-mount gull-wing termination and 1.27mm terminal pitch facilitate easy PCB integration.

GS8B036342JCT Features

• High Precision: ±5% absolute tolerance and ±0.25% ratio tolerance for consistent performance.
• Robust Construction: Ceramic case ensures durability and thermal stability.
• Low TCR: ±25ppm/°C minimizes resistance drift under temperature variations.
• Compact Design: 9.91mm length × 5.99mm depth × 1.45mm height (SOIC package) saves board space.
• Bussed Configuration: Simplifies circuit design by interconnecting multiple resistors.
• Wide Voltage Range: Supports up to 100V, suitable for industrial and automotive environments (though not PPAP/automotive-certified).
• Surface-Mount Ready: Gull-wing terminals enable automated assembly.

GS8B036342JCT Applications

• Signal Conditioning: Ideal for voltage dividers, pull-up/pull-down networks, and analog signal processing.
• Industrial Controls: Used in PLCs, sensor interfaces, and power management systems due to its stability.
• Test & Measurement Equipment: Precision resistance networks ensure accuracy in calibration circuits.
• Consumer Electronics: Compact size suits space-constrained designs like wearables and IoT devices.
• Telecom Infrastructure: Reliable for filtering and impedance matching in high-frequency circuits.

Conclusion of GS8B036342JCT

The GS8B036342JCT excels in applications demanding precision, thermal stability, and compactness. Its thin-film ceramic construction, low TCR, and bussed architecture make it superior to standard thick-film networks. While not automotive-grade, it is a cost-effective solution for industrial, telecom, and consumer electronics. Engineers will appreciate its ease of integration, consistent performance, and robust design, making it a versatile choice for modern PCB layouts.