TT Electronics/IRC_GS8B036492FDT
original

TT Electronics/IRC
GS8B036492FDT

50-GS8B036492FDT
PDF Datasheet
Ceramic Resistor Network, SOIC-C Series,16-Pin Narrow SOIC, Bussed elements,±25ppm/°C, 64.9KOhm, absolute tolerance ±1%, ratio tolerance ±0.5%
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
15
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS8B036492FDT Description

GS8B036492FDT Description

The GS8B036492FDT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, it features 15 bussed resistors with a 64.9KΩ resistance value and a tight ±1% absolute tolerance, ensuring consistent performance. The device operates over a wide temperature range of 70°C to 125°C with a ±25ppm/°C temperature coefficient, making it suitable for stable, high-accuracy circuits. Its thin-film technology and ceramic case style provide excellent thermal stability and durability, while the gull-wing termination ensures reliable surface-mount assembly.

GS8B036492FDT Features

  • High Precision: ±1% absolute tolerance and ±0.5% ratio tolerance for critical applications.
  • Robust Construction: Ceramic substrate enhances thermal and mechanical reliability.
  • Wide Operating Range: Rated for 125°C maximum temperature and 100V maximum voltage.
  • Optimized Power Handling: 0.05W per resistor (0.8W total) with derating up to 125°C.
  • Compact & Durable: SOIC package (9.91mm × 5.99mm × 1.45mm) with ±0.1mm dimensional tolerances.
  • Automation-Friendly: Gull-wing leads for easy PCB mounting and inspection.

GS8B036492FDT Applications

This resistor network excels in:

  • Analog Signal Conditioning: Precision voltage dividers and sensor interfaces.
  • Industrial Control Systems: Stable performance in harsh environments.
  • Medical Electronics: Reliable operation in diagnostic equipment.
  • Test & Measurement: High-accuracy instrumentation requiring minimal drift.
  • Telecom Infrastructure: Signal processing and filtering circuits.

Conclusion of GS8B036492FDT

The GS8B036492FDT combines precision, durability, and compact design, making it ideal for applications demanding tight tolerances and thermal stability. Its ceramic construction and thin-film technology outperform plastic-based networks in reliability, while the SOIC package ensures compatibility with automated assembly processes. A top choice for engineers prioritizing performance, longevity, and space efficiency in critical circuits.

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