TT Electronics/IRC

GS8B036800GFT

GS8B036800GFT Description

The GS8B036800GFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC package features 15 bussed resistors with a 680Ω resistance value and a tight ±2% absolute tolerance, ensuring consistent performance. Built with thin-film technology, it offers a low temperature coefficient of ±25ppm/°C, making it stable across a wide operating temperature range of -55°C to +125°C. The SOIC-C series construction provides excellent thermal and mechanical stability, with a power rating of 0.8W (0.05W per resistor) and a maximum voltage rating of 100V. Its gull-wing termination and surface-mount design facilitate easy PCB integration.

GS8B036800GFT Features

• Ceramic case for enhanced durability and heat dissipation.
• Bussed network topology simplifies circuit design in multi-resistor applications.
• Thin-film technology ensures high precision and low noise.
• ±25ppm/°C TCR for minimal resistance drift under thermal stress.
• 2% tolerance and ±1% ratio tolerance for consistent performance.
• Compact SOIC-16 package (9.91mm x 5.99mm x 1.63mm) saves board space.
• Wide temperature range (-55°C to +125°C) for harsh environments.
• RoHS non-compliant (suitable for legacy or specialized applications).

GS8B036800GFT Applications

Ideal for precision analog circuits, voltage dividers, and signal conditioning in industrial, medical, and aerospace systems. Its low TCR and tight tolerance make it suitable for ADC/DAC reference networks, sensor calibration, and feedback loops in power supplies. The bussed design is advantageous in bus termination, pull-up/pull-down networks, and digital logic interfaces. Its ceramic construction ensures reliability in high-vibration or high-temperature environments, such as automotive control modules (non-AECQ qualified) and test/measurement equipment.

Conclusion of GS8B036800GFT

The GS8B036800GFT combines precision, stability, and compactness, making it a robust choice for demanding electronic designs. Its thin-film ceramic construction, low TCR, and bussed topology provide superior performance over standard thick-film networks. While not PPAP or automotive-qualified, it excels in industrial and instrumentation applications where accuracy and thermal resilience are critical. Engineers will appreciate its ease of integration and consistent performance in space-constrained, high-reliability systems.