TT Electronics/IRC

GS8B036982FDT

GS8B036982FDT Description

The GS8B036982FDT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding applications requiring stable performance under varying thermal conditions. Packaged in a 16-pin narrow SOIC (SOIC-C series), this bussed network integrates 15 thin-film resistors, each with a 69.8KΩ resistance and a tight ±1% absolute tolerance. Its ±25ppm/°C temperature coefficient ensures minimal resistance drift across the -70°C to +125°C operating range, making it suitable for precision analog and digital circuits. The 0.05W (1/20W) power rating per resistor and 100V maximum voltage rating provide reliable operation in compact, surface-mount designs.

GS8B036982FDT Features

• High Stability: Thin-film technology with ±25ppm/°C TCR for consistent performance in thermal environments.
• Precision Tolerance: ±1% absolute tolerance and ±0.5% ratio tolerance for matched resistor performance.
• Robust Construction: Ceramic case ensures durability and thermal dissipation.
• Compact Design: 9.91mm × 5.99mm × 1.45mm SOIC package with 1.27mm terminal pitch for high-density PCB layouts.
• Bussed Configuration: Simplified circuit design with shared connections, ideal for voltage division or pull-up/down networks.
• Wide Operating Range: Derated power up to 125°C, suitable for industrial and automotive-adjacent applications (non-automotive PPAP).

GS8B036982FDT Applications

• Analog Signal Conditioning: Precision voltage dividers in sensor interfaces or ADC/DAC circuits.
• Digital Pull-Up/Down Networks: Stable termination for buses (I2C, SPI) in embedded systems.
• Power Management: Current-limiting or feedback networks in DC-DC converters.
• Test & Measurement Equipment: High-accuracy resistor arrays for calibration or reference circuits.
• Industrial Controls: Reliable performance in harsh environments (e.g., motor drives, PLCs).

Conclusion of GS8B036982FDT

The GS8B036982FDT stands out for its combination of precision, thermal stability, and compact form factor, addressing challenges in space-constrained, high-reliability designs. While not RoHS-compliant, its ceramic construction and thin-film technology make it a robust choice for industrial and instrumentation applications where tolerance and temperature performance are critical. Engineers will appreciate its bussed architecture for simplifying board layouts without compromising accuracy.