TT Electronics/IRC

GS8B037680GFT

GS8B037680GFT Description

The GS8B037680GFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), this bussed network integrates 15 resistors with a common 768Ω value, offering a ±2% absolute tolerance and ±1% ratio tolerance. Built with thin-film technology, it ensures stable performance with a low ±25ppm/°C temperature coefficient. The device operates within a -70°C to +125°C derated power range, with a maximum voltage rating of 100V and a 0.8W total power rating (0.05W per resistor). Its gull-wing termination and surface-mount design facilitate easy PCB integration, while the ceramic case enhances thermal and mechanical reliability.

GS8B037680GFT Features

• Precision Network: 15 bussed resistors (768Ω) with ±2% tolerance and ±1% ratio tolerance for matched performance.
• Stable Performance: ±25ppm/°C TCR and thin-film construction ensure minimal drift under thermal stress.
• Robust Packaging: Ceramic SOIC-C case (9.91mm × 5.99mm × 1.45mm) with ±0.1mm height/length tolerances for consistent mounting.
• High-Temperature Operation: Rated for 125°C max operating temperature, suitable for harsh environments.
• Surface-Mount Ready: Gull-wing leads and 1.27mm pitch simplify automated assembly.
• Non-Automotive: PPAP non-compliant, ideal for industrial, telecom, and instrumentation uses.

GS8B037680GFT Applications

• Voltage Division & Pull-Up Networks: Precision resistor arrays for ADC/DAC reference circuits.
• Industrial Controls: Stable resistance in PLCs, sensors, and power management systems.
• Telecom Infrastructure: Signal conditioning and impedance matching in high-frequency modules.
• Test & Measurement Equipment: Low-drift networks for calibration and accuracy-critical designs.
• Aerospace & Defense: Reliable performance in extended temperature ranges (derated up to 125°C).

Conclusion of GS8B037680GFT

The GS8B037680GFT excels in precision, thermal stability, and compact integration, making it a standout choice for high-reliability electronics. Its ceramic construction, tight tolerances, and bussed design reduce component count while ensuring consistent performance. While not automotive-grade, it is ideal for industrial, telecom, and instrumentation applications demanding low TCR and robust packaging. Engineers will appreciate its balance of density, power handling, and ease of assembly in space-constrained designs.