TT Electronics/IRC

GS8B037870FBT

GS8B037870FBT Description

The GS8B037870FBT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, this bussed (BUS) thin-film resistor array integrates 15 resistors with a 787Ω resistance value and ±1% absolute tolerance. Its ±25ppm/°C temperature coefficient ensures stable performance across a wide operating range of -55°C to +125°C, with derated power handling up to 125°C. The 0.05W (1/20) power rating per resistor and 0.8W total power rating make it suitable for low-power circuits, while the 100V maximum voltage rating adds versatility. The SOIC-C series features a rectangular ceramic case, gull-wing termination, and 1.27mm terminal pitch, optimized for surface-mount assembly.

GS8B037870FBT Features

• Precision Thin-Film Technology: Delivers ±1% tolerance and ±0.1% ratio tolerance for matched resistance values.
• High-Temperature Stability: ±25ppm/°C TCR ensures minimal drift in harsh environments.
• Robust Construction: Ceramic substrate enhances thermal and mechanical reliability.
• Space-Efficient Design: 9.91mm × 5.99mm × 1.45mm compact footprint with ±0.1mm length/height tolerances.
• Automation-Friendly: Gull-wing leads and 1.27mm pitch simplify PCB placement.
• Non-Automotive/Non-PPAP: Ideal for industrial, telecom, and instrumentation use.

GS8B037870FBT Applications

• Voltage Divider Networks: Precision ratio tolerance (±0.1%) suits ADC/DAC reference circuits.
• Signal Conditioning: Stable thin-film performance in sensor interfaces and op-amp feedback loops.
• Power Management: Bussed design simplifies bus termination in low-power digital systems.
• Medical/Test Equipment: Ceramic construction resists thermal stress in high-reliability devices.
• Telecom Infrastructure: Compact SOIC package fits densely populated RF/analog PCBs.

Conclusion of GS8B037870FBT

The GS8B037870FBT excels in applications requiring tight tolerance, low TCR, and high-density resistor networks. Its ceramic SOIC package offers superior thermal performance over plastic alternatives, while the bussed architecture reduces component count in bus-termination designs. Though not RoHS-compliant or automotive-grade, it is a cost-effective solution for industrial, medical, and telecom systems where precision and durability are critical. Engineers will appreciate its balance of performance, size, and reliability in space-constrained, temperature-variable environments.