TT Electronics/IRC

GS8B038060CT

GS8B038060CT Description

The GS8B038060CT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, it features 15 bussed resistors with a 806Ω resistance value and an exceptional ±0.25% tolerance. Built using thin-film technology, it delivers stable performance across a wide temperature range (70°C to 125°C) with a low ±25ppm/°C temperature coefficient. The SOIC-C series construction ensures robustness, with a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating. Its gull-wing termination and surface-mount design facilitate easy PCB integration.

GS8B038060CT Features

• Precision & Stability: ±0.25% absolute tolerance and ±25ppm/°C TCR ensure reliable performance in precision circuits.
• Durable Construction: Ceramic case and thin-film technology enhance thermal and mechanical durability.
• Space-Efficient: Compact 9.91mm × 5.99mm × 1.45mm footprint with 1.27mm terminal pitch suits high-density layouts.
• High Voltage Handling: Supports up to 100V, ideal for industrial and automotive (non-AEC-Q200) applications.
• Bussed Network: Simplifies circuit design by connecting multiple resistors in a shared configuration.

GS8B038060CT Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers and sensor interfaces in test equipment.
• Industrial Control Systems: Stable resistance in PLCs, motor drives, and power supplies.
• Medical Electronics: Low-drift performance for diagnostic devices.
• Telecom Infrastructure: Reliable operation in base stations and networking hardware.

Conclusion of GS8B038060CT

The GS8B038060CT combines high precision, compact design, and rugged construction, making it a superior choice for engineers needing stable resistor networks in harsh environments. While not automotive-grade, its ceramic SOIC package and thin-film technology offer long-term reliability for industrial, medical, and telecom applications. Its bussed architecture reduces component count, streamlining PCB design without compromising accuracy.