TT Electronics/IRC

GS8B038202GAT

GS8B038202GAT Description

The GS8B038202GAT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 16-pin narrow SOIC package, it features 15 bussed resistors with a 82kΩ resistance value and a tight ±2% absolute tolerance. Its thin-film technology ensures excellent stability, supported by a low ±25ppm/°C temperature coefficient. The device operates over a wide temperature range (-70°C to +125°C) and delivers a 0.8W total power rating (0.05W per resistor), making it suitable for demanding environments. With a 100V maximum voltage rating and gull-wing termination, it offers reliable surface-mount compatibility. The EU RoHS non-compliant ceramic construction enhances durability in harsh conditions.

GS8B038202GAT Features

• High Precision: ±2% tolerance and ±0.05% ratio tolerance for accurate signal conditioning.
• Robust Construction: Ceramic case (SOIC-C series) ensures thermal and mechanical resilience.
• Stable Performance: Thin-film technology with ±25ppm/°C TCR minimizes drift.
• Space-Efficient: Compact 9.91mm × 5.99mm × 1.45mm footprint (SOIC-16) saves PCB real estate.
• Wide Operating Range: Functions reliably from -70°C to +125°C (derated power up to 125°C).
• Automotive-Grade Alternatives: While not PPAP/automotive-certified, its rugged design suits industrial applications.

GS8B038202GAT Applications

Ideal for precision analog circuits, voltage dividers, and bus termination networks, this resistor array excels in:

• Industrial Control Systems: Stable performance in PLCs and sensor interfaces.
• Test & Measurement Equipment: Low TCR ensures accuracy in calibration circuits.
• Telecommunications: Signal integrity in high-frequency PCBs.
• Power Management: Distributed power dissipation in multi-channel designs.

Conclusion of GS8B038202GAT

The GS8B038202GAT combines precision, durability, and compactness, making it a standout choice for engineers needing reliable resistor networks in harsh or precision-critical environments. Its ceramic SOIC package, low TCR, and bussed configuration offer distinct advantages over plastic-encased alternatives, particularly in high-temperature or high-voltage scenarios. While not automotive-qualified, its industrial-grade robustness ensures longevity in demanding applications.