TT Electronics/IRC

GS8B038202GGT

GS8B038202GGT Description

The GS8B038202GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 82KΩ resistance value and a tight ±2% absolute tolerance, ensuring reliable signal integrity. Built with thin-film technology, it offers excellent stability with a low ±25ppm/°C temperature coefficient, making it suitable for environments with fluctuating temperatures. The SOIC package (9.91mm x 5.99mm x 1.45mm) is optimized for surface-mount assembly, with gull-wing terminations for robust PCB connectivity. Rated for 100V maximum voltage and 0.8W total power dissipation, it operates reliably within a 70°C to 125°C derated power range.

GS8B038202GGT Features

• Ceramic substrate for enhanced thermal and mechanical stability.
• Bussed network topology simplifies circuit design in multi-resistor applications.
• Low TCR (±25ppm/°C) ensures minimal resistance drift under thermal stress.
• 2% tolerance for precision voltage division and current limiting.
• 1/20W power rating per resistor (0.8W total) balances compact size with performance.
• Narrow SOIC (16-pin) footprint saves board space versus discrete resistors.
• Non-automotive grade (PPAP: No), ideal for industrial and telecom systems.

GS8B038202GGT Applications

This resistor network excels in:

• Voltage dividers and pull-up/pull-down arrays in analog/digital circuits.
• Signal conditioning for sensors, ADCs, and DACs requiring matched resistances.
• Power management modules where stable, derated power handling is critical.
• Industrial control systems benefiting from its 125°C maximum operating temperature.
• Space-constrained designs (e.g., IoT devices) leveraging its compact SOIC form factor.

Conclusion of GS8B038202GGT

The GS8B038202GGT combines precision, durability, and space efficiency, making it a superior choice for engineers needing reliable resistor networks in harsh environments. Its ceramic construction, tight tolerances, and low TCR outperform plastic-encapsulated alternatives, while the bussed architecture reduces component count. Though not RoHS-compliant, it remains a robust solution for industrial, telecom, and embedded systems demanding long-term stability.