TT Electronics/IRC

GS8B038251JDT

GS8B038251JDT Description

The GS8B038251JDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors with a 8.25KΩ resistance value and a ±5% absolute tolerance. Its ±25ppm/°C temperature coefficient ensures stable performance across a wide operating range of -70°C to +125°C, making it suitable for environments with thermal fluctuations. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for surface-mount assembly. With a power rating of 0.8W (0.05W per resistor) and a maximum voltage rating of 100V, it balances compactness with reliability.

GS8B038251JDT Features

• Precision Thin-Film Technology: Delivers low noise and high stability for signal conditioning.
• Robust Ceramic Package: Enhances thermal dissipation and mechanical durability.
• Bussed Circuit Design: Simplifies PCB layout in bus termination and voltage divider applications.
• Tight Ratio Tolerance (±0.5%): Critical for matched impedance in differential signaling or ADC/DAC circuits.
• Wide Temperature Range: Operates reliably from -70°C to +125°C, outperforming standard networks.
• Surface-Mount Optimized: 1.27mm terminal pitch and 1.45mm profile enable high-density designs.

GS8B038251JDT Applications

• Industrial Control Systems: Ideal for PLC I/O modules requiring stable resistor networks.
• Automotive Electronics: Suitable for sensor interfaces (non-automotive qualified).
• Test & Measurement Equipment: Precision attenuators or calibration circuits.
• Telecommunications: Line termination in high-speed data buses.
• Medical Devices: Low-drift performance for patient monitoring systems.

Conclusion of GS8B038251JDT

The GS8B038251JDT excels in precision, thermal resilience, and space efficiency, distinguishing it from generic resistor arrays. Its ceramic substrate and thin-film technology cater to applications demanding long-term stability under thermal stress. While not PPAP or automotive-qualified, it remains a top choice for industrial, medical, and telecom designs where tight tolerance and compact form factor are critical. Engineers will appreciate its balance of performance and reliability in mission-critical circuits.