TT Electronics/IRC

GS8B039092GFT

GS8B039092GFT Description

The GS8B039092GFT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, this bussed array integrates 15 thin-film resistors, each with a 90.9 kΩ resistance and a tight ±2% absolute tolerance. The device operates over a wide temperature range of 70°C to 125°C with a low temperature coefficient (±25 ppm/°C), ensuring stable performance in thermally variable environments. Its SOIC-C series construction features a rectangular ceramic case, gull-wing terminations, and a compact footprint (9.91 mm × 5.99 mm × 1.45 mm), making it suitable for space-constrained designs. Rated for 100 V maximum voltage and 0.8 W total power dissipation, it combines robustness with precision.

GS8B039092GFT Features

• High-Density Integration: 15 resistors in a 16-pin SOIC package, reducing PCB footprint.
• Superior Stability: ±25 ppm/°C TCR and ±2% tolerance ensure minimal drift under thermal stress.
• Robust Construction: Ceramic substrate enhances thermal conductivity and durability.
• Automation-Friendly: Gull-wing leads and 1.27 mm pitch simplify surface-mount assembly.
• Wide Operating Range: Derated power up to 125°C, ideal for industrial and automotive environments (though not PPAP/automotive-qualified).
• Low Power Dissipation: 0.05 W per resistor (1/20 W) balances performance and energy efficiency.

GS8B039092GFT Applications

• Precision Voltage Dividers: Leverages ±1% ratio tolerance for accurate signal conditioning.
• Industrial Control Systems: Stable performance in high-temperature PLCs or motor drives.
• Test & Measurement Equipment: Low TCR minimizes calibration drift in multimeters or sensors.
• Consumer Electronics: Space-saving solution for audio amplifiers or power management ICs.
• Telecom Infrastructure: Reliable termination for high-frequency signal lines.

Conclusion of GS8B039092GFT

The GS8B039092GFT excels in applications requiring compactness, precision, and thermal resilience. Its ceramic thin-film technology and bussed architecture offer a competitive edge over polymer-based networks, particularly in environments where thermal stability and long-term reliability are critical. While not automotive-grade, its industrial-rated specs make it a versatile choice for embedded systems, instrumentation, and power electronics. Engineers will appreciate its balance of performance, density, and cost-effectiveness in high-volume SMT designs.