TT Electronics/IRC

GS8B039532GDT

GS8B039532GDT Description

The GS8B039532GDT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), it features 15 bussed thin-film resistors with a 95.3KΩ resistance value, offering an absolute tolerance of ±2% and a ratio tolerance of ±0.5%. The device operates over a wide temperature range of -55°C to +125°C, with derated power handling up to 125°C. Its ±25ppm/°C temperature coefficient ensures stability in fluctuating environments. The 0.05W (1/20) power rating per resistor and 0.8W total power rating make it suitable for low-power circuits, while the 100V maximum voltage rating adds versatility.

GS8B039532GDT Features

• Ceramic substrate for enhanced thermal performance and durability.
• Thin-film technology delivers high precision and low noise.
• Bussed network (BUS designator) simplifies circuit design by interconnecting resistors.
• Gull-wing termination ensures reliable surface-mount (SMD) assembly.
• Compact dimensions: 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm L/H, ±0.2mm D).
• Non-automotive (PPAP No) but ideal for industrial and telecom applications.
• Non-RoHS compliant, suitable for legacy or specialized systems.

GS8B039532GDT Applications

This resistor network excels in:

• Voltage division and signal conditioning in precision analog circuits.
• Feedback networks for op-amps and ADCs/DACs.
• Industrial control systems requiring stable, low-drift performance.
• Telecommunication infrastructure, such as line drivers and filters.
• Test and measurement equipment where ratio tolerance (±0.5%) is critical.

Conclusion of GS8B039532GDT

The GS8B039532GDT stands out for its ceramic construction, thin-film accuracy, and bussed topology, offering reliability in precision applications. While not RoHS-compliant, its thermal stability (±25ppm/°C) and tight tolerances make it a robust choice for industrial and telecom designs. Its SOIC package ensures compatibility with automated assembly, reducing manufacturing costs. Ideal for engineers prioritizing performance over compliance, this network balances precision, power handling, and space efficiency.