TT Electronics/IRC

GS8B039760BAT

GS8B039760BAT Description

The GS8B039760BAT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding applications requiring tight tolerance and stability. Housed in a 16-pin narrow SOIC package, this bussed (BUS) network integrates 15 thin-film resistors with a 976Ω resistance value and an exceptional ±0.1% absolute tolerance (±0.05% ratio tolerance). Its ±25ppm/°C temperature coefficient ensures minimal drift across the -70°C to +125°C operating range, making it suitable for precision analog and digital circuits. The SOIC-C series construction features a ceramic case for robust thermal and mechanical performance, with gull-wing terminations for reliable surface-mount assembly.

GS8B039760BAT Features

• High Precision: ±0.1% tolerance and ±25ppm/°C TCR for stable performance in critical circuits.
• Robust Construction: Ceramic substrate and thin-film technology enhance durability and heat dissipation.
• Compact Design: 9.91mm × 5.99mm × 1.45mm footprint with 1.27mm terminal pitch, ideal for space-constrained PCBs.
• Wide Voltage Range: Supports up to 100V, with a 0.8W total power rating (0.05W per resistor).
• Automation-Friendly: Gull-wing termination and surface-mount (SOIC) package streamline high-volume assembly.
• Non-Automotive: Not PPAP-capable, but excels in industrial, medical, and test equipment applications.

GS8B039760BAT Applications

This resistor network is optimized for:

• Precision Voltage Dividers: High-accuracy signal conditioning in data acquisition systems.
• Medical Instrumentation: Stable reference networks in patient monitoring devices.
• Industrial Control Systems: Reliable performance in PLCs and sensor interfaces.
• Test & Measurement Equipment: Low-drift resistance networks for calibration circuits.
• Aerospace & Defense: Ruggedized electronics where thermal stability is critical.

Conclusion of GS8B039760BAT

The GS8B039760BAT stands out for its tight tolerance, low TCR, and ceramic-based reliability, making it a superior choice over plastic-encapsulated networks in harsh environments. While not automotive-grade, its precision and compact form factor cater to high-reliability industrial and medical designs. Engineers will appreciate its balance of performance and manufacturability, particularly in applications demanding long-term stability under thermal stress.