TT Electronics/IRC

GUS-QS0B-02-3300-CB

GUS-QS0B-02-3300-CB Description

The GUS-QS0B-02-3300-CB from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 19-resistor array features a 330Ω resistance value per element with an ultra-tight 0.25% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stable performance across a wide operating temperature range of 70°C to 125°C. Housed in a compact 20-pin QSOP package with gull-wing terminations, it offers a 1W total power rating (0.05W per resistor) and a 100V maximum voltage rating, making it suitable for high-density PCB designs. The non-automotive, non-PPAP compliant device is supplied in tube packaging for efficient handling.

GUS-QS0B-02-3300-CB Features

• Precision Thin Film Technology: Delivers superior accuracy (±0.25%) and low TCR (±50ppm/°C) for signal conditioning and voltage division.
• Robust Construction: QSOP package (8.66mm × 6.02mm × 1.47mm) with ±0.1mm dimensional tolerances ensures reliable SMT assembly.
• High Power Handling: 1W total dissipation (0.05W per resistor) at 125°C maximum temperature, derated for extended reliability.
• BUS Circuit Designator: Optimized for bus termination and pull-up/pull-down networks in digital systems.
• Non-RoHS Compliant: Suitable for legacy or specialized applications requiring non-compliant materials.

GUS-QS0B-02-3300-CB Applications

• Digital Systems: Ideal for bus termination, impedance matching, and pull-up/down networks in FPGAs, ASICs, and memory interfaces.
• Test & Measurement Equipment: Precision voltage dividers and reference circuits due to low TCR and tight tolerance.
• Industrial Controls: Reliable performance in PLC modules, sensor interfaces, and power management PCBs.
• Aerospace & Defense: Non-RoHS compliance meets specific legacy system requirements.

Conclusion of GUS-QS0B-02-3300-CB

The GUS-QS0B-02-3300-CB stands out for its precision, compact form factor, and high power density, making it a top choice for engineers designing high-reliability analog and mixed-signal circuits. Its thin-film technology and BUS-oriented design provide a competitive edge over thicker-film or less stable alternatives, particularly in space-constrained, high-temperature environments. While not suited for automotive use, it excels in industrial, telecom, and aerospace applications where accuracy and durability are critical.