


TT Electronics/IRC
GUS-QS0B-03-1582-FB
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GUS-QS0B-03-1582-FB Description
GUS-QS0B-03-1582-FB Description
The GUS-QS0B-03-1582-FB is a high-precision thin-film resistor network from TT Electronics/IRC, designed for demanding surface-mount applications. This 20-pin QSOP package integrates 19 resistors with a 15.8KΩ resistance value, offering a tight 1% tolerance and a low ±25ppm/°C temperature coefficient. Rated for 1W total power dissipation (0.05W per resistor), it operates reliably across a 70°C to 125°C derated power range, with a maximum operating temperature of 125°C. Its gull-wing termination and 0.64mm terminal pitch ensure secure PCB mounting, while the compact 8.66mm × 6.02mm × 1.47mm footprint suits space-constrained designs. Non-compliant with EU RoHS, it is packaged in a tube for automated assembly.
GUS-QS0B-03-1582-FB Features
- Precision Thin Film Technology: Delivers stable performance with low noise and high accuracy (±1%).
- Robust Power Handling: 1W total rating (1/20W per resistor) at elevated temperatures (up to 125°C).
- Compact QSOP Package: Rectangular 20-pin form factor (6.02mm depth, 1.63mm seated height) optimizes board space.
- Wide Voltage Range: Supports up to 100V maximum voltage, ideal for mixed-signal circuits.
- Automation-Friendly: Gull-wing leads and tube packaging streamline high-volume SMT processes.
- BUS Circuit Designator: Simplifies integration into bus line termination and pull-up/down networks.
GUS-QS0B-03-1582-FB Applications
- Analog/Digital Signal Conditioning: Precision voltage dividers in ADCs, DACs, and sensor interfaces.
- Bus Termination Networks: EMI reduction in high-speed data lines (e.g., SPI, I²C).
- Industrial Controls: Stable resistance in PLCs, motor drives, and power management systems.
- Test & Measurement Equipment: Calibration circuits requiring low TCR and long-term stability.
- Aerospace & Defense: Non-RoHS compliant variants for specialized environments.
Conclusion of GUS-QS0B-03-1582-FB
The GUS-QS0B-03-1582-FB excels in precision applications where thermal stability, space efficiency, and high power density are critical. Its thin-film construction and tight tolerances make it superior to thick-film alternatives in performance-sensitive designs. While not suited for automotive (non-PPAP) or RoHS-regulated markets, it is a robust choice for industrial, instrumentation, and high-reliability systems. Engineers will value its balance of compactness, power handling, and electrical consistency in complex circuit topologies.



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