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GUS-QS0B-03-2492-JB
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GUS-QS0B-03-2492-JB Description
GUS-QS0B-03-2492-JB Description
The GUS-QS0B-03-2492-JB from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. It features 19 resistors in a 20-pin QSOP package with a 24.9KΩ resistance value, 5% tolerance, and a ±25ppm/°C temperature coefficient. Rated for 1W total power dissipation (0.05W per resistor), it operates reliably across a wide temperature range of 70°C to 125°C, with a maximum operating temperature of 125°C. The gull-wing termination and surface-mount design ensure easy PCB integration, while the compact 8.66mm × 6.02mm × 1.47mm footprint makes it ideal for space-constrained designs.
GUS-QS0B-03-2492-JB Features
- Thin-film technology ensures high stability, low noise, and superior accuracy.
- 19-resistor network with a BUS circuit designator, simplifying circuit routing.
- 100V maximum voltage rating and 1W power handling for robust performance.
- QSOP package with 0.64mm terminal pitch, enabling high-density PCB layouts.
- Wide operating temperature range (70°C to 125°C) suitable for industrial environments.
- Non-automotive (PPAP: No) and non-RoHS compliant, making it ideal for legacy or specialized applications.
- Tube packaging for secure handling and storage.
GUS-QS0B-03-2492-JB Applications
This resistor network excels in precision analog circuits, signal conditioning, and voltage division applications. Its low TCR (±25ppm/°C) and thin-film construction make it ideal for:
- Medical instrumentation requiring stable resistance over temperature.
- Industrial control systems where reliability under thermal stress is critical.
- Test & measurement equipment demanding high accuracy.
- Telecommunication hardware needing compact, high-density resistor arrays.
Conclusion of GUS-QS0B-03-2492-JB
The GUS-QS0B-03-2492-JB stands out for its precision, power handling, and compact form factor, making it a top choice for engineers designing high-reliability electronics. While not suited for automotive use, its thin-film technology and robust thermal performance ensure long-term stability in demanding industrial and medical applications. Its QSOP gull-wing package further enhances PCB assembly efficiency, solidifying its role in advanced circuit designs.



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