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GUS-QS0B-03-3011-FD
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GUS-QS0B-03-3011-FD Description
GUS-QS0B-03-3011-FD Description
The GUS-QS0B-03-3011-FD from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 20-pin QSOP package integrates 19 resistors, each with a 3.01KΩ resistance, 1% tolerance, and a ±25ppm/°C temperature coefficient, ensuring stability across a wide temperature range (70°C to 125°C). With a 1W total power rating (0.05W per resistor) and a 100V maximum voltage rating, it offers robust performance in compact designs. The gull-wing termination and 0.64mm terminal pitch facilitate reliable PCB assembly, while the 1.47mm low-profile height suits space-constrained layouts.
GUS-QS0B-03-3011-FD Features
- Precision Thin Film Technology: Delivers low noise and high stability for sensitive circuits.
- High-Density Integration: 19 resistors in a 6.02mm x 8.66mm QSOP package, optimizing board space.
- Wide Operating Range: Rated for -55°C to +125°C, with derated power up to 125°C.
- Automotive-Grade Alternatives: While this model is not PPAP or automotive-certified, its reliability suits industrial and telecom applications.
- Superior Thermal Performance: 1W total dissipation and thin-film construction minimize thermal drift.
- RoHS Non-Compliant: Note: Contains materials exempt from EU RoHS directives.
GUS-QS0B-03-3011-FD Applications
- Analog Signal Conditioning: Ideal for precision dividers, DAC/ADC interfaces, and sensor networks.
- Medical Electronics: Stable performance in patient monitoring equipment.
- Test & Measurement: Low TCR (±25ppm/°C) ensures accuracy in calibration circuits.
- Industrial Controls: Robust operation in PLCs and motor drivers.
- Communications: Used in RF matching networks and filter circuits.
Conclusion of GUS-QS0B-03-3011-FD
The GUS-QS0B-03-3011-FD excels in applications requiring high-density, precision resistance with minimal thermal variance. Its QSOP gull-wing package and thin-film technology make it a superior choice over thicker-film networks in environments where space, power efficiency, and signal integrity are critical. While not suited for automotive use, it remains a cost-effective solution for industrial, medical, and telecom systems demanding reliable performance. Packaged in tubes for automated assembly, it streamlines high-volume production.



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