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GUS-QS0B-03-3601-GD
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GUS-QS0B-03-3601-GD Description
GUS-QS0B-03-3601-GD Description
The GUS-QS0B-03-3601-GD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount PCB assemblies. This 20-pin QSOP package integrates 19 resistors, each with a 3.6KΩ resistance value, a tight 2% tolerance, and a low ±25ppm/°C temperature coefficient, ensuring stable performance across a wide operating temperature range of 70°C to 125°C. With a 1W total power rating (0.05W per resistor) and a 100V maximum voltage rating, this network is engineered for reliability in demanding circuits. Its gull-wing termination and 0.64mm terminal pitch facilitate easy soldering and high-density mounting.
GUS-QS0B-03-3601-GD Features
- Precision Thin Film Technology: Delivers superior accuracy (±2%) and low TCR (±25ppm/°C) for stable signal conditioning.
- Robust Construction: QSOP package (8.66mm x 6.02mm x 1.47mm) with ±0.1mm dimensional tolerances ensures consistent fit.
- High Power Handling: 1W total dissipation (0.05W per resistor) supports energy-efficient designs.
- Wide Temperature Range: Operates reliably from 70°C to 125°C, ideal for industrial and automotive-adjacent applications.
- BUS Circuit Designator: Optimized for bus termination, voltage division, and pull-up/down networks.
- Non-Automotive (PPAP No): Suitable for industrial, telecom, and instrumentation use.
GUS-QS0B-03-3601-GD Applications
- Signal Integrity Circuits: Precision termination for high-speed data buses (e.g., DDR, SPI).
- Voltage Dividers: Stable reference networks in ADC/DAC interfaces.
- Industrial Control Systems: Reliable performance in PLCs and sensor interfaces.
- Telecom Infrastructure: Impedance matching in RF modules and baseband processing.
- Test & Measurement Equipment: Low-drift resistance networks for calibration circuits.
Conclusion of GUS-QS0B-03-3601-GD
The GUS-QS0B-03-3601-GD excels in applications demanding precision, thermal stability, and compact integration. Its thin-film technology, tight tolerances, and robust power handling make it a superior choice over thicker-film or carbon-based alternatives. While not automotive-grade, it is ideal for industrial, telecom, and high-reliability electronics where consistent performance under thermal stress is critical. Packaged in tubes for ESD protection, it ensures safe handling and assembly.



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