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GUS-QS0B-03-4752-FA
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GUS-QS0B-03-4752-FA Description
GUS-QS0B-03-4752-FA Description
The GUS-QS0B-03-4752-FA from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 20-pin QSOP-packaged device integrates 19 resistors with a 47.5KΩ resistance value, offering 1% tolerance and a low ±25ppm/°C temperature coefficient. Rated for 1W total power dissipation (0.05W per resistor), it operates reliably across a wide temperature range of -70°C to +125°C, with a maximum voltage rating of 100V. Its gull-wing termination and 0.64mm terminal pitch ensure compatibility with automated PCB assembly processes. The compact dimensions (8.66mm x 6.02mm x 1.47mm) make it ideal for space-constrained designs.
GUS-QS0B-03-4752-FA Features
- Precision Thin Film Technology: Delivers stable performance with minimal drift over temperature and time.
- High-Density Integration: 19 resistors in a QSOP-20 package reduce board space versus discrete components.
- Robust Power Handling: 1W total rating (derated to 70°C–125°C) suits power-sensitive applications.
- Low TCR (±25ppm/°C): Ensures consistent resistance in varying thermal environments.
- Automation-Friendly: Gull-wing leads and 0.64mm pitch enable high-speed SMT placement.
- Non-Automotive/Non-PPAP: Optimized for industrial, telecom, and instrumentation use.
GUS-QS0B-03-4752-FA Applications
- Signal Conditioning: Precision voltage dividers in data acquisition systems.
- Medical Electronics: Patient monitoring equipment requiring stable analog circuits.
- Test & Measurement: Calibration circuits and reference networks.
- Industrial Controls: Feedback networks in PLCs and motor drives.
- Telecom Infrastructure: Impedance matching in high-frequency modules.
Conclusion of GUS-QS0B-03-4752-FA
The GUS-QS0B-03-4752-FA excels in applications demanding high precision, thermal stability, and space efficiency. Its thin-film construction, tight tolerance, and low TCR outperform carbon-based networks, while the QSOP package simplifies integration. Though not automotive-grade, it is a cost-effective solution for industrial and telecom designs where reliability and miniaturization are critical. Supplied in tubes, it streamlines production for medium-to-high-volume manufacturing.



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