


TT Electronics/IRC
GUS-QS0B-03-7500-JF
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GUS-QS0B-03-7500-JF Description
GUS-QS0B-03-7500-JF Description
The GUS-QS0B-03-7500-JF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount PCB assemblies. This 20-pin QSOP package integrates 19 resistors, each with a 750Ω resistance value and a 5% tolerance, delivering a total power rating of 1W (0.05W per resistor). The device operates over a wide temperature range of 70°C to 125°C, with a low temperature coefficient of ±25ppm/°C, ensuring stability in demanding environments. Its gull-wing termination and 0.64mm terminal pitch facilitate reliable soldering in high-density layouts. Packaged in a tube for automated handling, this non-automotive, non-PPAP compliant component is ideal for industrial and commercial electronics.
GUS-QS0B-03-7500-JF Features
- Thin-Film Technology: Offers superior accuracy, low noise, and stable performance compared to thick-film alternatives.
- High Power Density: 1W total dissipation in a compact 8.66mm × 6.02mm × 1.47mm footprint.
- Wide Voltage Rating: Supports up to 100V, suitable for signal conditioning and voltage division.
- Robust Construction: Rectangular QSOP case with a 1.63mm seated height ensures mechanical durability.
- Non-Compliant Lead-Free (EU RoHS): For applications not requiring RoHS adherence.
- BUS Circuit Designator: Simplifies integration into bus-line termination and pull-up/pull-down networks.
GUS-QS0B-03-7500-JF Applications
- Signal Processing: Precision voltage dividers in ADC/DAC circuits.
- Industrial Controls: Interface modules requiring stable resistance under thermal stress.
- Test & Measurement Equipment: Calibration networks due to low TCR (±25ppm/°C).
- Communication Systems: Termination resistors for high-speed data lines.
- Power Management: Current-limiting arrays in low-power DC/DC converters.
Conclusion of GUS-QS0B-03-7500-JF
The GUS-QS0B-03-7500-JF excels in space-constrained, precision-critical designs, combining thin-film reliability with QSOP packaging efficiency. Its 750Ω network, 1W power handling, and ±25ppm/°C TCR make it a standout choice for engineers prioritizing thermal stability and compactness. While not suited for automotive use, it is a cost-effective solution for industrial, telecom, and instrumentation applications demanding repeatable performance.



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