


TT Electronics/IRC
GUS-QS0B-03-8202-FB
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GUS-QS0B-03-8202-FB Description
GUS-QS0B-03-8202-FB Description
The GUS-QS0B-03-8202-FB from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 20-pin QSOP (Quarter Small Outline Package) device integrates 19 resistors, each with a 82K Ohm resistance value and a tight 1% tolerance, ensuring reliable signal conditioning and voltage division. Rated for 1W total power dissipation (0.05W per resistor), it operates across a wide temperature range of -70°C to +125°C, with a low ±25ppm/°C temperature coefficient for stable performance under thermal stress. The gull-wing termination and surface-mount design facilitate automated assembly, while the 100V maximum voltage rating makes it suitable for industrial and instrumentation circuits.
GUS-QS0B-03-8202-FB Features
- Precision Thin Film Technology: Delivers ±1% tolerance and ±25ppm/°C TCR for minimal drift.
- Robust Construction: QSOP package (8.66mm x 6.02mm x 1.47mm) with ±0.1mm height/length tolerances ensures mechanical consistency.
- High Power Handling: 1W total power rating (1/20W per resistor) at 125°C maximum operating temperature.
- Automation-Friendly: Gull-wing leads with 0.64mm pitch enable high-speed PCB placement.
- Non-Automotive/Non-PPAP: Ideal for industrial, telecom, and test equipment where PPAP compliance isn’t required.
GUS-QS0B-03-8202-FB Applications
- Signal Conditioning: Precision dividers and feedback networks in data acquisition systems.
- Medical Electronics: Stable resistance for patient monitoring devices and diagnostic equipment.
- Telecom Infrastructure: Impedance matching in RF modules and baseband circuits.
- Test & Measurement: Calibration circuits requiring low TCR and high accuracy.
- Industrial Controls: Durable performance in PLC I/O modules and sensor interfaces.
Conclusion of GUS-QS0B-03-8202-FB
The GUS-QS0B-03-8202-FB excels in precision analog circuits demanding thermal stability, compactness, and repeatability. Its thin-film technology, high power density, and gull-wing SMD design make it a superior alternative to thick-film networks in critical applications. While not RoHS-compliant, it remains a top choice for harsh-environment industrial systems where reliability outweighs regulatory constraints. Engineers will value its balance of performance, size, and cost in space-constrained designs.



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