TT Electronics/IRC

GUS-QS8A-01-1070-GC

GUS-QS8A-01-1070-GC Description

The GUS-QS8A-01-1070-GC from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount PCB assemblies. This 8-resistor isolated network features a 107Ω resistance value per resistor with a tight 2% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across a wide operating temperature range of 70°C to 125°C. Housed in a compact 16-pin QSOP (QSOP-16) package, it offers a 0.75W (3/4W) total power rating (0.1W per resistor) and supports 100V maximum voltage, making it suitable for demanding circuit isolation tasks.

GUS-QS8A-01-1070-GC Features

• Thin-Film Technology: Delivers superior accuracy, low noise, and long-term stability compared to thick-film alternatives.
• High-Density Design: Compact 4.9mm (L) × 6.02mm (D) × 1.47mm (H) footprint with 0.64mm terminal pitch, ideal for space-constrained layouts.
• Robust Construction: Gull-wing termination ensures reliable solder joints in automated SMD processes.
• Isolated Configuration (ISOL): Each resistor operates independently, preventing cross-talk in critical signal paths.
• Wide Temperature Range: Derated power operation up to 125°C for industrial and telecom applications.
• Tube Packaging: Facilitates handling and pick-and-place assembly.

GUS-QS8A-01-1070-GC Applications

This resistor network excels in:

• Precision Analog Circuits: Voltage dividers, feedback networks, and sensor interfaces requiring tight tolerance.
• Signal Isolation: Buffering and impedance matching in communication systems (e.g., RS-485, CAN bus).
• Medical Electronics: Patient monitoring equipment where stability and low drift are critical.
• Industrial Controls: PLCs, motor drives, and power supplies needing high-voltage isolation.
• Test & Measurement: Calibration circuits and instrumentation amplifiers.

Conclusion of GUS-QS8A-01-1070-GC

The GUS-QS8A-01-1070-GC combines high precision, compactness, and isolation in a single package, addressing challenges in modern electronics where space and reliability are paramount. Its thin-film construction, low TCR, and robust QSOP package make it a standout choice for engineers designing high-density, high-reliability systems. While not RoHS-compliant, its performance in harsh environments and automotive-derivative applications (despite lacking PPAP/automotive certification) underscores its versatility. Ideal for OEMs prioritizing repeatability and thermal stability in SMT assemblies.