TT Electronics/IRC

GUS-QS8A-01-1473-JA

GUS-QS8A-01-1473-JA Description

The GUS-QS8A-01-1473-JA from TT Electronics/IRC is a high-performance 8-resistor thin-film network designed for precision applications. Encased in a 16-pin QSOP package with gull-wing SMD termination, this device offers a 147K Ohm resistance per resistor with a 5% tolerance and a ±100ppm/°C temperature coefficient. Rated for 0.75W (3/4W) total power dissipation and 0.1W (1/10W) per resistor, it operates reliably across a wide temperature range of -70°C to +125°C, making it suitable for demanding environments. The isolated (ISOL) circuit design ensures minimal crosstalk, while the 100V maximum voltage rating enhances durability in high-voltage circuits. Packaged in a tube for secure handling, this RoHS-non-compliant component is ideal for industrial and commercial electronics.

GUS-QS8A-01-1473-JA Features

• Thin-Film Technology: Delivers superior stability, low noise, and precise resistance matching.
• Compact QSOP Package: Measures just 4.9mm (L) x 6.02mm (D) x 1.47mm (H), optimizing PCB space.
• High Power Handling: 0.75W total rating with derated performance up to 125°C.
• Isolated Design (ISOL): Eliminates interference between resistors, critical for signal integrity.
• Gull-Wing Termination: Ensures robust solder joints for surface-mount assembly.
• Wide Terminal Pitch (0.64mm): Facilitates easier soldering and inspection.

GUS-QS8A-01-1473-JA Applications

• Analog Signal Conditioning: Precision voltage dividers, gain networks in op-amp circuits.
• Industrial Controls: PLCs, sensor interfaces, and isolation barriers.
• Test & Measurement Equipment: Calibration circuits, reference networks.
• Power Management: Feedback networks in DC-DC converters, load sharing.
• Automotive (Non-Automotive Rated): Prototyping or non-safety-critical systems.

Conclusion of GUS-QS8A-01-1473-JA

The GUS-QS8A-01-1473-JA excels in high-density, precision applications where space, thermal stability, and signal isolation are critical. Its thin-film construction and QSOP packaging provide a competitive edge over thicker-film or bulkier alternatives. While not PPAP or automotive-qualified, it remains a cost-effective solution for industrial, commercial, and prototyping needs. Engineers will appreciate its balance of performance, compactness, and reliability in demanding circuits.