TT Electronics/IRC

GUS-QS8A-02-1330-GG

GUS-QS8A-02-1330-GG Description

The GUS-QS8A-02-1330-GG from TT Electronics/IRC is a high-performance 8-resistor thin-film network designed for precision applications. Encased in a 16-pin QSOP package with gull-wing SMD termination, this device offers a 133Ω resistance per element with a tight 2% tolerance and a low ±50ppm/°C temperature coefficient. Its isolated (ISOL) circuit design ensures independent resistor functionality, making it ideal for signal conditioning and voltage division. With a 0.75W (3/4W) total power rating (0.1W per resistor) and a 100V maximum voltage rating, it operates reliably across a 70°C to 125°C derated power range, peaking at 125°C maximum operating temperature. The compact 4.9mm × 6.02mm × 1.47mm footprint and 0.64mm terminal pitch enable high-density PCB layouts.

GUS-QS8A-02-1330-GG Features

• Precision Thin Film Technology: Delivers stable performance with low TCR (±50ppm/°C) and 2% tolerance.
• High Power Handling: 0.75W total (0.1W per resistor) in a miniaturized QSOP package.
• Isolated Resistor Network: Independent resistors (ISOL design) for flexible circuit integration.
• Robust Construction: Gull-wing SMD termination ensures reliable solder joints in automated assembly.
• Wide Temperature Range: Operates from 70°C to 125°C (derated) with a 125°C maximum rating.
• Compact & Lightweight: 4.9mm × 6.02mm × 1.47mm dimensions suit space-constrained designs.

GUS-QS8A-02-1330-GG Applications

• Signal Conditioning: Precision voltage division in sensor interfaces and ADC/DAC circuits.
• Industrial Electronics: PLCs, motor drives, and power supplies requiring stable resistor networks.
• Test & Measurement Equipment: Calibration and reference circuits due to low TCR and tolerance.
• Telecom Infrastructure: Line termination and impedance matching in high-frequency PCBs.
• Medical Devices: Reliable performance in diagnostic equipment where precision is critical.

Conclusion of GUS-QS8A-02-1330-GG

The GUS-QS8A-02-1330-GG excels in applications demanding precision, power efficiency, and compactness. Its thin-film technology, isolated design, and robust QSOP package make it superior to thicker-film or bulkier alternatives. While not RoHS-compliant, it remains a top choice for industrial and telecom systems where reliability under thermal stress is paramount. Engineers will appreciate its balance of performance, size, and cost in high-density PCB designs.