


TT Electronics/IRC
GUS-QS8A-02-3302-DA
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GUS-QS8A-02-3302-DA Description
GUS-QS8A-02-3302-DA Description
The GUS-QS8A-02-3302-DA is a high-precision 8-resistor thin film network from TT Electronics/IRC, designed for demanding surface-mount applications. Featuring a 33K Ohm resistance per resistor with a tight 0.5% tolerance and a low ±50ppm/°C temperature coefficient, this component ensures stable performance across a wide temperature range (70°C to 125°C). Packaged in a 16-pin QSOP with gull-wing terminations, it offers a compact footprint (4.9mm × 6.02mm × 1.47mm) while delivering 0.1W per resistor and a total power rating of 0.75W. Its isolated (ISOL) circuit design and 100V maximum voltage rating make it suitable for precision analog and digital circuits.
GUS-QS8A-02-3302-DA Features
- Thin Film Technology: Ensures low noise, high stability, and precision.
- High Power Density: 0.75W total power in a compact QSOP package.
- Tight Tolerance: 0.5% resistance accuracy for critical applications.
- Wide Temperature Range: Operates reliably from 70°C to 125°C with derated power.
- Robust Construction: Gull-wing terminations and ±0.1mm dimensional tolerances ensure reliable SMT assembly.
- Isolated Design (ISOL): Each resistor is electrically independent, ideal for multi-channel isolation.
GUS-QS8A-02-3302-DA Applications
This resistor network excels in:
- Precision Analog Circuits: Voltage dividers, feedback networks, and sensor conditioning.
- Industrial Electronics: PLCs, motor drives, and instrumentation requiring stable resistance under thermal stress.
- Telecom & Networking: Signal conditioning and impedance matching in high-frequency PCBs.
- Medical Devices: Low-noise, high-reliability circuits where tolerance and TCR are critical.
- Automotive (Non-Automotive Rated): Prototyping or non-safety-critical systems.
Conclusion of GUS-QS8A-02-3302-DA
The GUS-QS8A-02-3302-DA combines precision, power efficiency, and compactness, making it a superior choice for engineers needing reliable thin-film resistor networks. Its isolated design, tight tolerances, and robust packaging address challenges in high-density, high-performance electronics, particularly where space and thermal management are constraints. While not PPAP or automotive-qualified, it remains a cost-effective solution for industrial and telecom applications demanding long-term stability.



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