TT Electronics/IRC

GUS-QS8A-02-6802-GA

GUS-QS8A-02-6802-GA Description

The GUS-QS8A-02-6802-GA from TT Electronics/IRC is a high-performance 8-resistor isolated thin-film network designed for precision applications. Encased in a 16-pin QSOP package with gull-wing surface-mount termination, it offers a 68K Ohm resistance per resistor with a tight 2% tolerance and a low ±50ppm/°C temperature coefficient. The device operates within a wide temperature range of 70°C to 125°C and supports a maximum voltage rating of 100V, making it suitable for demanding environments. Its 0.75W (3/4W) total power rating and 0.1W (1/10W) per resistor ensure reliable performance in compact designs.

GUS-QS8A-02-6802-GA Features

• Thin-Film Technology: Delivers superior stability, precision, and low noise compared to thick-film alternatives.
• Isolated Circuit Design (ISOL): Each resistor operates independently, enhancing flexibility in circuit design.
• Compact QSOP Package: Measures just 4.9mm (L) × 6.02mm (D) × 1.47mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• High Power Density: 0.75W total dissipation in a miniature footprint, ideal for space-constrained PCBs.
• Robust Construction: Withstands 125°C maximum operating temperature and complies with EAR99 (ECCN) for export flexibility.

GUS-QS8A-02-6802-GA Applications

This resistor network excels in:

• Precision Analog Circuits: Voltage dividers, feedback networks, and sensor conditioning in test/measurement equipment.
• Industrial Controls: PLCs, motor drives, and power supplies requiring stable resistance under thermal stress.
• Telecommunications: Signal processing and impedance matching in RF/module designs.
• Medical Electronics: Isolated signal paths in diagnostic devices where consistency is critical.

Conclusion of GUS-QS8A-02-6802-GA

The GUS-QS8A-02-6802-GA combines high accuracy, thermal resilience, and compact form factor, making it a standout choice for engineers prioritizing reliability in harsh or precision-dependent environments. Its isolated thin-film architecture and QSOP packaging offer a competitive edge over bulkier or less stable alternatives, particularly in automotive-excluded (non-PPAP) industrial and telecom applications.