


TT Electronics/IRC
GUS-QS8A-03-3482-FB
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GUS-QS8A-03-3482-FB Description
GUS-QS8A-03-3482-FB Description
The GUS-QS8A-03-3482-FB is a high-precision thin-film resistor network from TT Electronics/IRC, designed for demanding surface-mount applications. This 16-pin QSOP package features eight isolated 34.8 kΩ resistors with a tight 1% tolerance and a low ±25 ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). With a 0.75W (3/4W) total power rating and 0.1W per resistor, it delivers reliable power handling in compact designs. The gull-wing termination and 0.64mm pitch facilitate easy PCB integration, while its 4.9mm × 6.02mm × 1.47mm footprint optimizes space efficiency.
GUS-QS8A-03-3482-FB Features
- Precision Thin Film Technology: Ensures low noise, high stability, and excellent TCR performance.
- Isolated Resistors (ISOL): Independent 34.8 kΩ resistors for flexible circuit design.
- High Power Handling: 0.75W total (0.1W per resistor) with derating up to 125°C.
- Compact QSOP Package: 16-pin gull-wing SMD with 1.63mm seated height for high-density layouts.
- Robust Construction: 100V maximum voltage rating and rectangular package shape for mechanical durability.
- Non-Automotive Grade: Ideal for industrial, telecom, and instrumentation applications where PPAP compliance is not required.
GUS-QS8A-03-3482-FB Applications
This resistor network excels in:
- Precision Analog Circuits: Voltage dividers, feedback networks, and sensor conditioning.
- Signal Processing: DAC/ADC reference networks, gain setting, and impedance matching.
- Industrial Electronics: PLCs, test equipment, and power supply control.
- Telecom Infrastructure: RF modules and signal attenuation systems.
- Space-Constrained Designs: Medical devices and portable instrumentation due to its QSOP footprint.
Conclusion of GUS-QS8A-03-3482-FB
The GUS-QS8A-03-3482-FB combines precision, power efficiency, and compactness, making it a superior choice for engineers needing reliable thin-film networks in high-density PCB designs. Its isolated resistors, low TCR, and robust package address challenges in noise-sensitive and thermally variable environments, while the QSOP form factor ensures compatibility with modern SMT assembly processes. For non-automotive applications requiring stable resistance values under thermal stress, this model delivers exceptional performance.



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