TT Electronics/IRC

GUS-QS8A-03-3600-GB

GUS-QS8A-03-3600-GB Description

The GUS-QS8A-03-3600-GB from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin QSOP (Quarter Small Outline Package) device features 8 isolated 360Ω resistors with a tight 2% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stable performance across a wide operating temperature range of 70°C to 125°C. With a 0.75W (3/4W) total power rating (0.1W per resistor) and a maximum voltage rating of 100V, it is engineered for reliability in demanding circuits. The gull-wing termination and surface-mount design facilitate easy PCB integration, while its compact dimensions (4.9mm x 6.02mm x 1.47mm) make it ideal for space-constrained designs.

GUS-QS8A-03-3600-GB Features

• Precision Thin Film Technology: Delivers superior accuracy (±25ppm/°C) and stability.
• Isolated Resistor Network (ISOL): Each of the 8 resistors operates independently, reducing crosstalk.
• High Power Handling: 0.75W total (0.1W per resistor) with derating up to 125°C.
• Compact QSOP Package: 16-pin gull-wing SMD with a 0.64mm terminal pitch for high-density layouts.
• Wide Voltage Range: Supports up to 100V, suitable for industrial and telecom applications.
• Robust Construction: Rectangular QSOP case with tight tolerances (±0.1mm height, ±0.2mm depth).

GUS-QS8A-03-3600-GB Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers, feedback networks.
• Industrial Control Systems: Isolated measurement circuits, PLCs.
• Telecommunications: Line termination, impedance matching.
• Medical Electronics: Low-noise, high-stability sensor interfaces.
• Automotive (Non-Automotive Rated): Prototyping or non-safety-critical circuits.

Conclusion of GUS-QS8A-03-3600-GB

The GUS-QS8A-03-3600-GB combines precision, power efficiency, and compactness, making it a standout choice for engineers requiring reliable resistor networks in high-density, temperature-variable environments. Its isolated design and thin-film technology offer superior performance over thicker-film alternatives, while the QSOP package ensures compatibility with modern SMD assembly processes. Ideal for industrial, telecom, and instrumentation applications, this component delivers consistent performance where accuracy and durability are critical.