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GUS-QS8B-00-3830-GF
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GUS-QS8B-00-3830-GF Description
GUS-QS8B-00-3830-GF Description
The GUS-QS8B-00-3830-GF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount PCB assemblies. This 16-pin QSOP package integrates 15 resistors with a 383Ω resistance value, offering a 2% tolerance and a ±250ppm/°C temperature coefficient for stable operation across a wide temperature range (70°C to 125°C). With a 0.75W (3/4W) total power rating and 0.05W (1/20W) per resistor, it balances power handling with compact dimensions (4.9mm length × 6.02mm depth × 1.47mm height). The gull-wing termination ensures reliable solder joints, while the 100V maximum voltage rating makes it suitable for low-to-medium voltage circuits. Packaged in a tube, it is ideal for automated assembly processes.
GUS-QS8B-00-3830-GF Features
- Precision Thin Film Technology: Delivers low noise and high stability for sensitive analog/digital circuits.
- Compact QSOP Package: Saves board space with a 0.64mm terminal pitch and 1.63mm seated height.
- Robust Power Handling: 0.75W total dissipation (0.05W per resistor) ensures reliability in dense layouts.
- Wide Temperature Range: Operates from 70°C to 125°C with derated power, suitable for industrial environments.
- Automation-Friendly: Gull-wing leads and tube packaging streamline pick-and-place assembly.
- Non-Automotive/Non-PPAP: Optimized for commercial and industrial use cases.
GUS-QS8B-00-3830-GF Applications
- Signal Conditioning: Precision voltage dividers and pull-up/pull-down networks in sensor interfaces.
- Analog/Digital Conversion: Reference resistor arrays for ADCs/DACs in measurement equipment.
- Communication Systems: Impedance matching in RF modules and data transmission circuits.
- Power Management: Current-limiting networks in low-power DC/DC converters.
- Industrial Controls: Durable performance in PLC I/O modules and motor drivers.
Conclusion of GUS-QS8B-00-3830-GF
The GUS-QS8B-00-3830-GF excels in space-constrained, precision applications requiring stable resistance values under thermal stress. Its thin-film construction, compact QSOP footprint, and gull-wing termination make it a superior choice over thicker-film or through-hole alternatives. While not RoHS-compliant, it remains a cost-effective solution for industrial, telecom, and instrumentation designs demanding repeatable performance. Engineers will appreciate its balance of power density, tolerance, and ease of integration in high-reliability systems.



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