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GUS-QS8B-00-6492-GF
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GUS-QS8B-00-6492-GF Description
GUS-QS8B-00-6492-GF Description
The GUS-QS8B-00-6492-GF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin QSOP surface-mount device integrates 15 resistors with a 64.9K Ohm resistance value and a tight 2% tolerance, ensuring reliable signal conditioning and voltage division. Rated for 0.75W (3/4W) total power dissipation and 0.05W (1/20W) per resistor, it operates across a wide temperature range of 70°C to 125°C, with a maximum operating temperature of 125°C. Its ±250ppm/°C temperature coefficient guarantees stability in varying thermal conditions, while the 100V maximum voltage rating suits medium-voltage circuits. Packaged in a tube for automated assembly, this RoHS non-compliant network is ideal for industrial and commercial electronics.
GUS-QS8B-00-6492-GF Features
- Precision Thin Film Technology: Delivers low noise and high accuracy for sensitive analog circuits.
- Compact QSOP Package: 4.9mm (L) x 6.02mm (D) x 1.47mm (H) footprint saves PCB space.
- Gull Wing Termination: Ensures robust solder joints for surface-mount applications.
- High Power Handling: 0.75W total power with derated performance up to 125°C.
- BUS Circuit Designator: Optimized for bus line termination and pull-up/down applications.
- Automated Assembly-Friendly: 0.64mm terminal pitch and tube packaging streamline production.
GUS-QS8B-00-6492-GF Applications
- Signal Conditioning: Precision voltage dividers in sensor interfaces.
- Bus Termination: Impedance matching for I2C, SPI, or CAN bus systems.
- Industrial Controls: Stable performance in PLC modules and motor drivers.
- Test & Measurement Equipment: Reliable resistance networks for calibration circuits.
- Consumer Electronics: Space-constrained designs like wearables and IoT devices.
Conclusion of GUS-QS8B-00-6492-GF
The GUS-QS8B-00-6492-GF excels in precision, power efficiency, and miniaturization, making it a superior choice for high-density PCBs requiring stable resistance networks. Its thin-film technology and QSOP packaging offer a competitive edge over thicker-film or larger-form-factor alternatives. While not suited for automotive (non-PPAP) or RoHS-restricted designs, it remains a cost-effective solution for industrial, commercial, and instrumentation applications demanding tight tolerances and thermal resilience.



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