TT Electronics/IRC

GUS-QS8B-00-73R2-JF

GUS-QS8B-00-73R2-JF Description

The GUS-QS8B-00-73R2-JF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount configurations. This 16-pin QSOP package integrates 15 resistors, each with a 73.2Ω resistance value and a 5% tolerance, delivering a total power rating of 0.75W (3/4W). Its thin-film technology ensures excellent stability, with a ±250ppm/°C temperature coefficient, making it suitable for environments with operating temperatures ranging from 70°C to 125°C. The device features gull-wing terminations for reliable SMD assembly and is supplied in a protective tube.

GUS-QS8B-00-73R2-JF Features

• Compact & Robust Design: Measures 4.9mm (L) × 6.02mm (D) × 1.47mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• High Power Handling: 0.05W per resistor (total 0.75W) and 100V maximum voltage rating for demanding circuits.
• Stable Performance: Thin-film construction ensures low noise and high accuracy over a wide -55°C to +125°C range.
• Automated Assembly Friendly: 0.64mm terminal pitch and gull-wing leads optimize pick-and-place efficiency.
• Non-Automotive, Non-PPAP: Ideal for industrial and commercial applications where PPAP compliance isn’t required.

GUS-QS8B-00-73R2-JF Applications

• Signal Conditioning: Precision voltage dividers and pull-up/down networks in data acquisition systems.
• Embedded Systems: Space-constrained PCBs in IoT devices, medical instrumentation, and test equipment.
• Power Management: Current-limiting and load-sharing in low-power DC/DC converters.
• Communication Hardware: Impedance matching in RF modules and high-speed digital interfaces.

Conclusion of GUS-QS8B-00-73R2-JF

The GUS-QS8B-00-73R2-JF excels in high-density, precision circuits requiring stable resistance values under thermal stress. Its thin-film technology, compact QSOP package, and robust power rating make it a superior alternative to thicker-film or less stable networks. While not RoHS-compliant, it remains a cost-effective choice for industrial, telecom, and embedded designs where reliability and miniaturization are critical. Engineers will appreciate its balance of performance, size, and ease of integration in SMD workflows.