TT Electronics/IRC

GUS-QS8B-00-8661-JF

GUS-QS8B-00-8661-JF Description

The GUS-QS8B-00-8661-JF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount PCB assemblies. This 16-pin QSOP package integrates 15 resistors, each with a 8.66KΩ resistance value and a 5% tolerance, delivering a total power rating of 0.75W (3/4W). The device operates within a wide temperature range of 70°C to 125°C (derated) and withstands maximum operating temperatures up to 125°C, making it suitable for demanding environments. Its ±250ppm/°C temperature coefficient ensures stable performance under thermal variations. The gull-wing termination and 0.64mm terminal pitch facilitate reliable soldering in high-density layouts.

GUS-QS8B-00-8661-JF Features

• Thin-Film Technology: Offers superior accuracy, low noise, and long-term stability compared to thick-film alternatives.
• High Power Handling: 0.05W per resistor (total 0.75W) enables robust performance in power-sensitive circuits.
• Compact QSOP Package: 4.9mm (L) x 6.02mm (D) x 1.47mm (H) dimensions optimize space in miniaturized designs.
• Automotive-Grade Durability: While not PPAP-certified, its 100V maximum voltage rating and wide temperature range suit industrial and telecom applications.
• Non-RoHS Compliance: Ideal for legacy systems where lead-free alternatives are unsuitable.

GUS-QS8B-00-8661-JF Applications

• Voltage Division & Pull-Up Networks: Precision resistor arrays for ADC/DAC interfaces and microcontroller I/O conditioning.
• Industrial Control Systems: Reliable performance in PLCs, motor drives, and power supplies.
• Telecommunications: Signal conditioning and impedance matching in RF modules and base stations.
• Test & Measurement Equipment: Stable resistance values for calibration circuits and sensor interfaces.

Conclusion of GUS-QS8B-00-8661-JF

The GUS-QS8B-00-8661-JF excels in high-density, precision circuits requiring thermal stability and compact form factors. Its thin-film construction and QSOP packaging provide a competitive edge in industrial and telecom applications, though its non-RoHS status may limit use in eco-regulated markets. Engineers will value its balance of power handling, tolerance, and space efficiency in critical designs.