TT Electronics/IRC

GUS-QS8B-00-9310-JF

GUS-QS8B-00-9310-JF Description

The GUS-QS8B-00-9310-JF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount PCB assemblies. This 16-pin QSOP package integrates 15 resistors, each with a 931Ω resistance value and a tight 5% tolerance, ensuring consistent performance in demanding circuits. With a 0.75W (3/4W) total power rating and 0.05W (1/20W) per resistor, it balances power dissipation and compactness. The ±250ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for environments with thermal fluctuations. Its gull-wing termination and 0.64mm terminal pitch facilitate reliable soldering in automated assembly processes.

GUS-QS8B-00-9310-JF Features

• Thin-Film Technology: Delivers superior stability, low noise, and precision compared to thick-film alternatives.
• High-Density Integration: 15 resistors in a 4.9mm × 6.02mm × 1.47mm QSOP package, optimizing board space.
• Robust Power Handling: 0.75W total rating with derated operation up to 125°C.
• Wide Voltage Range: Supports up to 100V, ideal for mixed-signal and power distribution circuits.
• Automated Assembly-Friendly: Gull-wing leads and ±0.1mm height tolerance ensure compatibility with pick-and-place systems.
• Non-Automotive/Non-PPAP: Suited for industrial, telecom, and instrumentation applications where PPAP compliance isn’t required.

GUS-QS8B-00-9310-JF Applications

• Voltage Division & Pull-Up Networks: Precision resistor arrays for ADC/DAC reference circuits.
• Signal Conditioning: Stable performance in sensor interfaces and feedback loops.
• Industrial Controls: Reliable operation in PLCs, motor drives, and power supplies.
• Telecom Infrastructure: Compact solution for line termination and impedance matching.
• Test & Measurement Equipment: Low-drift performance for calibration and signal processing.

Conclusion of GUS-QS8B-00-9310-JF

The GUS-QS8B-00-9310-JF excels in space-constrained, precision applications requiring stable resistance values under thermal stress. Its thin-film construction, high power density, and gull-wing termination offer a competitive edge over bulkier or less stable alternatives. While not RoHS-compliant, it remains a top choice for industrial and telecom systems where reliability and miniaturization are critical. Engineers will appreciate its balance of performance, durability, and ease of integration in high-density PCB designs.