TT Electronics/IRC

GUS-QS8B-01-2611-JF

GUS-QS8B-01-2611-JF Description

The GUS-QS8B-01-2611-JF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount PCB assemblies. This 16-pin QSOP package features 15 resistors with a 2.61KΩ resistance value, 5% tolerance, and a ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). With a 0.75W (3/4W) total power rating and 0.05W (1/20W) per resistor, it delivers reliable power dissipation in compact designs. The gull-wing termination and 0.64mm terminal pitch facilitate easy soldering and high-density mounting.

GUS-QS8B-01-2611-JF Features

• Thin-Film Technology: Offers superior accuracy, low noise, and stability compared to thick-film alternatives.
• Robust Construction: QSOP package with rectangular shape and tight tolerances (±0.1mm height, ±0.2mm depth) ensures mechanical reliability.
• High Voltage Handling: Supports 100V maximum voltage, ideal for industrial and automotive (non-AECQ) applications.
• Wide Temperature Range: Operates from 70°C to 125°C with derated power, suitable for harsh environments.
• Non-RoHS Compliant: May be preferred for legacy or specialized systems requiring leaded components.

GUS-QS8B-01-2611-JF Applications

• Precision Analog Circuits: Voltage dividers, feedback networks, and sensor interfaces in test/measurement equipment.
• Signal Conditioning: DAC/ADC reference networks, amplifier biasing, and filter networks.
• Industrial Controls: PLCs, motor drives, and power supplies where consistent resistance values are critical.
• Telecom Infrastructure: RF modules and baseband processing requiring low TCR drift.

Conclusion of GUS-QS8B-01-2611-JF

The GUS-QS8B-01-2611-JF excels in space-constrained, high-reliability applications due to its thin-film precision, robust power handling, and gull-wing SMD compatibility. While not automotive-grade (PPAP/No AECQ), it is a cost-effective solution for industrial, telecom, and instrumentation designs demanding stable performance under thermal stress. Its tube packaging ensures safe handling and storage for automated assembly processes.