


TT Electronics/IRC
GUS-QS8B-01-2670-JG
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GUS-QS8B-01-2670-JG Description
GUS-QS8B-01-2670-JG Description
The GUS-QS8B-01-2670-JG is a high-performance thin-film resistor network from TT Electronics/IRC, designed for precision applications in compact surface-mount assemblies. This 16-pin QSOP package integrates 15 resistors, each with a 267 Ω resistance value and a tight 5% tolerance, ensuring reliable signal conditioning and voltage division. With a 0.75W (3/4W) total power rating and 0.05W per resistor, it delivers robust performance in space-constrained designs. The thin-film technology provides excellent stability, with a low ±100ppm/°C temperature coefficient, making it ideal for environments with fluctuating thermal conditions.
GUS-QS8B-01-2670-JG Features
- High-Density Integration: 15 resistors in a compact 4.9mm × 6.02mm × 1.47mm QSOP package, optimized for PCB space savings.
- Precision Performance: ±100ppm/°C TCR and 5% tolerance ensure consistent operation across a -70°C to +125°C temperature range.
- Robust Power Handling: 0.75W total power dissipation (0.05W per resistor) with a 100V maximum voltage rating.
- Reliable Termination: Gull-wing leads with 0.64mm pitch for secure surface-mount soldering.
- Non-Automotive Grade: Suitable for industrial, telecom, and instrumentation applications where PPAP compliance is not required.
- Non-RoHS: May be preferred for legacy systems requiring leaded components.
GUS-QS8B-01-2670-JG Applications
- Signal Conditioning: Precision voltage dividers and pull-up/down networks in data acquisition systems.
- Embedded Systems: Space-efficient resistor arrays for microcontroller I/O circuits and sensor interfaces.
- Telecommunications: Impedance matching and termination in high-frequency RF modules.
- Test & Measurement Equipment: Stable reference networks for calibration circuits and analog front-ends.
- Industrial Controls: Durable solution for PLC modules and power supply feedback loops.
Conclusion of GUS-QS8B-01-2670-JG
The GUS-QS8B-01-2670-JG combines thin-film precision, high power density, and compact form factor, making it a versatile choice for engineers prioritizing reliability in constrained layouts. Its wide temperature range and low TCR suit demanding environments, while the QSOP package ensures compatibility with automated assembly processes. Though not RoHS-compliant, it remains a cost-effective option for legacy or specialized applications where thin-film stability outweighs environmental restrictions. Ideal for industrial electronics, communication hardware, and precision analog circuits.



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